Sensor apparatus management methods and apparatus

• US 20060181242A1
• Filed: 03/01/2006
• Published: 08/17/2006
• Est. Priority Date: 04/19/2001
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Mundt, Randall L., Freed, Mason L., Spanos, Costas J.
• Granted Patent: US 7,531,984 B2
• Time in Patent Office: Days
• US Class Current: 320/109
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 7/00 Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
• CPC Class Codes: H02J 7/00034 Charger exchanging data with an electronic device, i.e. telephone, whose internal battery is under charge

Abstract

Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus.

Claims

1. A method of simultaneously communicating with and powering a sensor apparatus that includes a silicon wafer, a rechargeable battery supported by the wafer, and a secondary coil supported by the wafer, the method uses the sensor apparatus and a power charger, the power charger having a primary coil for inducing current in the secondary coil, the method comprising the steps of:

a) charging the battery with currents produced by the rectification of alternating currents induced in the secondary coil from the primary coil;

b) establishing communication between the power charger and the sensor apparatus by switching the induced current on and off; and

c) establishing communication between the sensor apparatus and the power charger by modulating the impedance of the secondary coil while the primary coil is active.

2. A method for wireless communication and wireless power transfer for a sensor apparatus and a sensor apparatus maintenance unit, the method comprising the steps of:

a) positioning a secondary coil proximal to a primary coil;

b) producing an alternating current flow within the primary coil;

c) modulating a characteristic of the primary coil in a predetermined pattern;

d) inducing an alternating current within the secondary coil;

e) rectifying the alternating current flow within the secondary coil;

f) detecting changes in the state of the secondary coil;

g) comparing detected changes in the state of the secondary coil to a predetermined set of patterns;

h) executing a preprogrammed sequence of steps in response to a match between the detected state changes and the predetermined set of patterns, one of the preprogrammed sequences of steps being the communication of the sensor apparatus status and data to an external system;

i) modulating a characteristic of the secondary coil in predetermined patterns;

j) inducing changes in a characteristic of the primary coil as a result of the modulation of the characteristic of the secondary coil;

k) detecting changes in a characteristic of the primary coil;

l) comparing detected changes in the state of the primary coil to a set of predetermined patterns to determine if there is a match; and

m) executing a preprogrammed sequence of steps in response to a match between the detected state changes and the set of predetermined patterns.

3. A maintenance unit for a sensor apparatus, the maintenance unit comprising:

a front opening unified pod for interfacing with a semiconductor wafer processing tool and

at least one of;

an information processor including executable code for managing and maintaining the sensor apparatus;

a communication device for information transfer with the sensor apparatus;

a power source for providing power to the information processor;

a power charger for providing power to charge the sensor apparatus;

a sensor apparatus detector;

a sensor apparatus orientation detector;

an information storage memory for storing at least one of measurement data, calibration coefficients, and commands; and

a second communication device for communication with an external information source.

4. The maintenance unit of claim 3, wherein the sensor apparatus orientation detector comprises a camera.

5. The maintenance unit of claim 3, wherein the sensor apparatus orientation detector comprises an encoder.

6. A maintenance unit for a sensor apparatus, the maintenance unit comprising:

a standard mechanical interface box configured for interfacing with a semiconductor wafer processing tool and

at least one of;

an information processor including executable code for managing and maintaining the sensor apparatus;

a communication device for information transfer with the sensor apparatus;

a power source for providing power to the information processor;

a power charger for providing power to charge the sensor apparatus;

a sensor apparatus detector;

a sensor apparatus orientation detector;

an information storage memory for storing at least one of measurement data, calibration coefficients, and commands;

a connector for receiving power from an external power resource;

a second communication device for communication with an external information source; and

an interface for coupling information to an information display such as a display of light emitting diodes and such as a liquid crystal display.

7. The maintenance unit of claim 6, wherein the sensor apparatus orientation detector comprises a camera.

8. The maintenance unit of claim 6, wherein the sensor apparatus orientation detector comprises an encoder.

9. In combination, a sensor apparatus having an information processor and a power source;

and a sensor apparatus maintenance unit having a housing for interfacing with a tool for processing a workpiece and a power charger for wirelessly charging the power source;

the sensor apparatus being configured for detecting when power is no longer being received from the maintenance unit;

the information processor including executable instructions for starting a predetermined data collection program in response to determining that the sensor apparatus is not receiving power for charging the power source.

10. The combination of claim 9 wherein the housing comprises a front opening unified pod for a semiconductor wafer processing tool.

11. The combination of claim 9 wherein the housing comprises a standard mechanical interface box for a semiconductor wafer processing tool.