Electronic device contact structures

• US 20060192194A1
• Filed: 02/09/2006
• Published: 08/31/2006
• Est. Priority Date: 04/15/2003
• Status: Active Grant

• Current Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Erchak, Alexei A., Lidorikis, Elefterios, Graff, John W.
• Granted Patent: US 7,482,640 B2
• Time in Patent Office: Days
• US Class Current: 257/13
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 6/1225 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: G02B 6/4298 coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Electronic device contact structures are disclosed.

Claims

1. A device, comprising:

a material body designed for use in an electronic device, the material body having a surface; and

a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising;

a patterned conductive layer having an interior portion; and

a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body, wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is tapered in shape.

2. The device of claim 1, wherein the device is a light-emitting diode.

3. The device of claim 1, wherein the device is a photonic lattice light-emitting diode.

4. The device of claim 1, wherein the insulating layer is patterned such that the conductive layer extends past at least one edge of the insulating layer to form an electrical contact to the material body.

5. The device of claim 1, wherein at least a portion of the patterned insulating layer is tapered in shape.

6. The device of claim 1, wherein at least a portion of the patterned conductive layer is tapered in shape.

7. The device of claim 1, wherein at least a portion of the patterned insulating layer is substantially triangular in shape.

8. The device of claim 1, wherein at least a portion of the patterned conductive layer is substantially triangular in shape.

9. The device of claim 1, wherein the patterned conductive layer comprises a metal.

10. The device of claim 1, wherein the patterned insulating layer comprises an oxide.

11. The device of claim 1, wherein the patterned insulating layer has a smaller area than the patterned conductive layer.

12. The device of claim 1, wherein the patterned insulating layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.

13. The device of claim 1, wherein a length of the patterned insulating layer is about the same as a length of the patterned conductive layer.

14. The device as in claim 1, wherein the contact structure is in electrical contact to a first conductive pad and a second conductive pad.

15. A device, comprising:

a material body designed for use in an electronic device, the material body having a surface; and

a contact structure supported by the surface of the material body and extending from a conductive pad, the contact structure comprising;

a patterned conductive layer having an interior portion; and

a patterned insulating layer disposed between the interior portion of the patterned conductive layer and the surface of the material body, the insulating layer patterned such that the conductive layer forms an electrical contact to the material body,

wherein the patterned insulating layer and/or the patterned conductive layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.

16. The device of claim 15, wherein the device is a light emitting diode.

17. The device of claim 15, wherein the device is a photonic lattice light-emitting diode.

18. The device of claim 15, wherein the insulating layer is patterned such that the conductive layer extends past at least one edge of the insulating layer to form an electrical contact to the material body.

19. The device of claim 15, wherein at least a portion of the patterned insulating layer is tapered in shape.

20. The device of claim 15, wherein at least a portion of the patterned conductive layer is tapered in shape.

21. The device of claim 15, wherein at least a portion of the patterned insulating layer and/or the patterned conductive layer is substantially triangular in shape.

22. The device of claim 15, wherein the patterned conductive layer comprises a metal.

23. The device of claim 15, wherein the patterned insulating layer comprises an oxide.

24. The device of claim 15, wherein the patterned insulating layer has a smaller area than the patterned conductive layer.

25. The device of claim 15, wherein a length of the patterned insulating layer is about the same as a length of the patterned conductive layer.

26. The device as in claim 15, wherein the contact structure is in electrical contact to a first conductive pad and a second conductive pad.

27. The device as in claim 15, wherein the patterned insulating layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.

28. The device as in claim 15, wherein the patterned conductive layer has a larger area at an end adjacent to the conductive pad than an area at a greater distance from the conductive pad.