Light emitting element mounting member, and semiconductor device using the same

• US 20060198162A1
• Filed: 03/15/2004
• Published: 09/07/2006
• Est. Priority Date: 03/18/2003
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Ishii, Takashi, Tsuzuki, Yasushi, Ishidu, Sadamu, Higaki, Kenjiro
• Granted Patent: US 7,518,155 B2
• Time in Patent Office: Days
• US Class Current: 362/623
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings

Abstract

The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.

A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

Claims

1. A light-emitting element mounting member comprising:

a substrate including an element mounting surface mounting a semiconductor light-emitting element and first and second conductive regions disposed on said element mounting surface and connected to said semiconductor light-emitting element;

a reflective member made of metal or alloy or metal composite material including a reflective surface defining an internal space for housing said semiconductor light-emitting element disposed on said element mounting surface; and

a metal layer disposed on said reflective surface;

wherein said reflective surface is sloped relative to said element mounting surface so that a diameter of said internal space is greater away from said element mounting surface.

2. A light-emitting element mounting member according to claim 1 further comprising a bonding layer bonding said element mounting surface and said reflective member wherein:

a heat resistance temperature of said bonding layer is at least 300 deg C.; and

said bonding layer melts at a temperature of no more than 700 deg C. and bonds said element mounting surface and said reflective member.

3. A light-emitting element mounting surface according to claim 1 wherein:

said substrate is insulative;

first and second through-holes are formed on said substrate;

said first conductor region is formed at said first through-hole; and

said second conductor region is formed at said second through-hole.

4. A semiconductor device according to claim 1 wherein a minimum formation dimension of metal film patterns of said first and/or said second conductor region is at least 5 microns and less than 100 microns.

5. A semiconductor device comprising:

a light-emitting element mounting member according to claim 1;

and

a semiconductor light-emitting element mounted on said element mounting surface;

wherein;

said semiconductor light-emitting element includes a main surface facing said element mounting surface and said substrate includes a bottom surface positioned opposite from said element mounting surface; and

a ratio H/L between a distance H from said bottom surface to said element mounting surface and a distance L along a direction of a long side of said main surface of said semiconductor light-emitting element is at least 0.3.

6. A semiconductor device according to claim 5 wherein an electrode is disposed on said main surface side of said semiconductor light-emitting element and is electrically connected to said first and/or said second conductor region.

7. A semiconductor device according to claim 5 wherein said main surface has an area of at least 1 mm².