Hermetic implantable stimulator

• US 20060200200A1
• Filed: 03/04/2005
• Published: 09/07/2006
• Est. Priority Date: 03/04/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Malinowski, Zdzislaw B., Colvin, Michael S., Halberg, Leslie I.
• Granted Patent: US 7,742,817 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61N 1/025 Digital circuitry features of electrotherapy devices, e.g. memory, clocks, processors
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37518 Anchoring of the implants, e.g. fixation
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

An implantable medical device, e.g., an implantable pulse generator, having a non-metal sealed housing and method of making same. An exemplary embodiment of the device includes a replenishable power source, coupling electronic components configured to generate a pulse signal to the replenishable power source, and an inorganic coating covering the electronic components and the power source to seal, preferably hermetically, the electronic components and the power source from a body environment.

Claims

1. A method of forming an implantable medical device, comprising:

mechanically and electrically coupling electronic components on a circuit board with a power source; and

applying an inorganic coating over said circuit board and said power source to seal the circuit board and power source from a body environment.

2. The method of claim 1, wherein the power source comprises a replenishable power source.

3. The method of claim 1, wherein applying said inorganic coating to said electronic components comprises reactive sputtering.

4. The method of claim 1, wherein applying said inorganic coating to said electronic components comprises applying silicon nitride.

5. The method of claim 1, wherein applying said inorganic coating to said electronic components comprises applying silicon dioxide.

6. The method of claim 1, wherein applying said inorganic coating to said electronic components comprises applying silicon oxinitride.

7. The method of claim 1, further comprising:

coupling feedthru pins to said electronic components; and

applying a mask to said feedthru pins before applying said inorganic coating to said electronic components and said power source.

8. The method of claim 7, further comprising:

removing said feedthru pin mask; and

coupling a connector to said feedthru pins.

9. The method of claim 8, further comprising:

coupling a connector assembly to said feedthru pins.

10. The method of claim 9, further comprising applying an impact resistant material to said inorganic coating.

11. The method of claim 10, wherein applying said impact resistant material comprises applying impact resistant epoxy to said inorganic coating.

12. The method of claim 10, further comprising applying a soft material over said impact resistant material.

13. The method of claim 12, wherein applying said soft material to said impact resistant material comprises applying silicone rubber.

14. The method of claim 10, further comprising forming suture holes in said silicone rubber.

15. An implantable medical device comprising:

a power source coupled electrically and mechanically to a circuit board; and

a non-organic coating over the circuit board and power source for sealing said power source and circuit board.

16. The device of claim 15, wherein said circuit board includes at least one of a microprocessor, clock circuitry, telemetry circuitry, and power circuitry configured to generate a pulse signal.

17. The device of claim 15, wherein said power source comprises a replenishable power source.

18. The device of claim 15, further comprising an impact resistant epoxy covering said non-organic coating.

19. The device of claim 18, further comprising a suture hole in at least part of said impact resistant epoxy.

20. The device of claim 15, wherein said non-organic coating comprises at least one of a silicon nitride, a silicon dioxide and a silicon oxinitride.

21. The device of claim 15, wherein said device comprises a pulse generator circuitry for producing electrical stimulus used to stimulate a nerve or body tissue.

22. A method of forming an implantable medical device, comprising:

mechanically coupling electronic components to a circuit board, wherein the electronic components are configured to generate an electrical stimulus;

mechanically and electrically coupling the circuit board to a power source; and

applying an inorganic coating over said circuit board and said power source seal the board and power source.

23. The method of claim 22, wherein said power source comprises a replenishable power source.

24. The method of claim 22, wherein applying inorganic coating over said circuit board and power source comprises forming the coating by reactive sputtering.

25. The method of claim 22, wherein said inorganic coating comprises at least one of a silicon nitride, a silicon dioxide, and a silicon oxinitride.

26. The method of claim 22, further comprising:

coupling feedthru pins to said electronic circuit board; and

applying a mask to said feedthru pins before applying an inorganic coating over said circuit board and said power source.

27. The method of claim 26, further comprising:

removing said mask from said feedthru pins; and

coupling a connector assembly to said feedthru pins.

28. The method of claim 27, wherein said connector assembly is configured to electrically couple the feedthru pins on the electronic circuit board with a stimulating lead via at least one lead connector that is part of the connector assembly.

29. The method of claim 28, further comprising applying an impact resistant material to said inorganic coating.

30. The method of claim 29, wherein applying said impact resistant material comprises applying an impact resistant epoxy to said inorganic coating.

31. The method of claim 30, further comprising applying a soft material over said impact resistant material.

32. The method of claim 31, wherein applying said soft material to said impact resistant material comprises applying a silicone rubber.

33. The method of claim 32, further comprising forming suture holes in said silicone rubber.