Blister Package with Integrated Electronic Tag and Method of Manufacture

• US 20060202830A1
• Filed: 02/25/2005
• Published: 09/14/2006
• Est. Priority Date: 02/25/2005
• Status: Active Grant

• Current Assignee: Tagsense Incorporated
• Original Assignee: Tagsense Incorporated, Tom Scharfeld
• Inventors: Fletcher, Richard, Scharfeld, Tom Ahlkvist
• Granted Patent: US 8,120,492 B2
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: B65D 77/00 Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An IC chip is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.

Claims

1. A blister package with integrated electronic tag comprising

A thermoformed, vacuum-formed, folded or otherwise formed electrically insulating sheet-like body having a number of cavities extruded from the surface of the body;

and

A lidding film layer which closes the openings of said cavities on said formed electrically insulating sheet-like body, wherein said lidding film layer contains one or more electrically conductive regions; and

An electronic circuit with two or more electrical connections to said electrically conductive regions, arranged to provide wireless electronic communication with an external RFID reader device.

2. The blister package of claim 1 wherein said electronic circuit is comprised of an integrated circuit.

3. The blister package of claim 1 wherein said electronic circuit is comprised of a chipless circuit comprising one or more passive electrically resonant elements.

4. The blister package of claim 2 wherein said electronic IC chip is comprised of an electronic polymer circuit.

5. The blister package of claim 2 wherein said lidding film layer is comprised of a metal foil.

6. The blister package of claim 2 wherein said lidding film layer is comprised of an electrically conducting polymer film.

7. The blister package of claim 2 wherein said lidding film layer comprises a first electrically conductive layer which closes the openings of said cavities on said formed electrically insulating sheet-like body, and a dielectric layer provided so as to cover a portion of said first electrically conductive layer, and a second electrically conductive layer disposed over a portion of said dielectric layer, arranged to provide wireless electronic communication with an external RFID reader device.

8. The blister package of claim 2 wherein said second electrically conductive layer is comprised of printed electrically conductive ink.

11. The blister package of claim 2 wherein said electrically conductive regions are arranged to provide wireless electronic communication with an external RFID reader device, and the coupling to said external RFID reader device is capacitive.

12. The blister package of claim 4 wherein said electrically conductive regions are arranged to provide wireless electronic communication with an external RFID reader device, and the coupling to said external RFID reader device is capacitive.

13. The blister package of claim 2 wherein said electrically conductive regions form a non-resonant antenna capable of electronically communicating with an external RFID reader device;

wherein the coupling to said external RFID reader device is capacitive.

14. The blister package of claim 2 wherein said electrically conductive regions form an electrically resonant antenna arranged to provide electronic wireless communication with an external RFID reader device.

15. The blister package of claim 2 wherein said electrically conductive regions form an antenna having a resonant frequency in the range of 868 MHz to 960 MHz arranged to provide electronic wireless communication with an external RFID reader device.

16. The blister package of claim 2 wherein said electrically conductive regions form an antenna having a resonant frequency in the range of 2400 MHz to 2500 MHz arranged to provide electronic wireless communication with an external RFID reader device.

9. A blister package with integrated electronic tag comprising

A thermoformed, vacuum-formed, folded or otherwise formed electrically insulating sheet-like body having a number of cavities extruded from the surface of the body;

and

A lidding film which closes the openings of the said cavities of said formed electrically insulating sheet-like body; and

Two or more electrically conductive regions placed on the extruded side of said formed electrically insulating sheet-like body opposing the side containing said lidding film; and

An electronic IC chip with two or more electrical connections to said electrically conductive regions, arranged to provide wireless electronic communication with an external RFID reader device.

10. A blister package with integrated electronic tag comprising

A thermoformed, vacuum-formed, folded or otherwise formed electrically insulating sheet-like body having a number of cavities extruded from the surface of the body;

and

A first lidding film which closes the openings of said cavities of said formed electrically insulating sheet-like body and partially covers the surface of said formed electrically insulating sheet-like body; and

A second lidding film comprised of two or more electrically conductive regions and disposed over a separate portion of said formed electrically insulating sheet-like body not covered by said first lidding film; and

An electronic IC chip with two or more electrical connections to said electrically conductive regions, arranged to provide wireless electronic communication with an external RFID reader device.

17. A blister package with integrated electronic tag comprising

A thermoformed, vacuum-formed, folded or otherwise formed electrically insulating sheet-like body having a number of cavities extruded from the surface of the body;

and

A lidding film layer which closes the openings of said cavities on the reverse face of said formed electrically insulating sheet-like body, wherein said lidding film layer contains an electrically conductive region patterned into the shape of a planar coil; and

An electronic IC chip with two or more electrical connections to said planar coil of said lidding film layer arranged to provide wireless electronic communication with an external RFID reader device, wherein the coupling to said external RFID reader device is inductive.

18. A blister package with integrated electronic tag comprising

A thermoformed, vacuum-formed, folded or otherwise formed electrically insulating sheet-like body having a number of cavities extruded from the surface of the body;

and

A lidding film layer which closes the openings of said cavities on the reverse face of said formed electrically insulating sheet-like body, wherein said lidding film layer contains an electrically conductive region patterned into the shape of a planar coil; and

A second layer containing an electrically conductive region in the shape of a planar coil that overlaps said planar coil of the lidding film layer and is electrically connected at one end to said planar coil of the lidding film layer; and

An electronic IC chip with two or more electrical connections to said planar coil disposed on said lidding film layer, and said planar coil disposed on said second layer arranged to provide wireless electronic communication with an external RFID reader, wherein the coupling to said external RFID reader device is inductive.

19. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film;

(b) patterning of said lidding film to form one or more distinct electrically conductive regions;

(c) attachment of IC chip after step (a) to said patterned lidding film;

(d) providing a blister film, wherein said blister film is electrically insulating;

(e) forming one or more blister cavities in said blister film;

(f) filling said blister cavities with product contents; and

(g) sealing said lidding film to said blister film.

20. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film;

(b) patterning of said lidding film to form one or more distinct electrically conductive regions;

(c) providing a blister film, wherein said blister film is electrically insulating;

(d) attaching IC chip to said blister film after step (c);

(e) forming one or more blister cavities in said blister film;

(f) filling said blister cavities with product contents;

(g) sealing said lidding film to said blister film; and

(h) electrically coupling IC chip after step (f) to said lidding film.

21. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a first lidding film;

(b) patterning of said first lidding film to form one or more distinct electrically conductive regions;

(c) depositing a dielectric coating over portions of said first lidding film;

(d) providing a second lidding film, said second lidding film being electrically conductive;

(e) patterning of said second lidding film to form one or more distinct electrically conductive regions;

(f) placing said second lidding film over first lidding film;

(g) joining one edge of said first lidding film to one edge of said second lidding film such that a contiguous electrically conducting region is formed therein;

(h) attachment of IC chip to said said second lidding film after step (g), such that electrical contact is made between IC chip and first lidding film and between IC chip and second lidding film;

(i) providing a blister film, wherein said blister film is electrically insulating;

(j) forming one or more blister cavities in said blister film;

(k) filling said blister cavities with product contents; and

(l) sealing said lidding film to said blister film.

22. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a first lidding film;

(b) patterning of said first lidding film to form one or more distinct electrically conductive regions;

(c) depositing a dielectric coating over portions of said first lidding film;

(d) printing an electrically conductive pattern over said dielectric coating, such that said electrically conductive pattern is electrically connected to said first lidding film;

(e) attachment of IC chip after step (d) to said electrically conductive pattern, such that electrical contact is made between said IC chip and said first lidding film and between said IC chip and said electrically conductive pattern;

(f) providing a blister film, wherein said blister film is electrically insulating;

(g) forming one or more blister cavities in said blister film;

(h) filling said blister cavities with product contents; and

(i) sealing said lidding film to said blister film.

23. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film, wherein said lidding film is electrically conductive;

(b) providing a blister film, wherein said blister film is electrically insulating;

(c) attaching IC chip after step (b) to said blister film;

(d) forming one or more blister cavities in said blister film;

(e) filling said blister cavities with product contents; and

(f) sealing a first portion of lidding film to a first portion of the blister film;

(g) sealing a second portion of lidding film to a second portion of the blister film; and

(h) electrically coupling IC chip after step (e) to said lidding film.

24. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film, wherein said lidding film is electrically conductive;

(b) providing a blister film, wherein said blister film is electrically insulating;

(c) forming one or more blister cavities in said blister film;

(d) filling said blister cavities with product contents;

(e) sealing a first portion of lidding film to a first portion of the blister film;

(f) attaching IC chip after step (e) to said lidding film;

(g) sealing a second portion of lidding film to a second portion of the blister film; and

(h) electrically coupling IC chip after step (d) to said first portion of lidding film and said second portion of lidding film.

25. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film, wherein said lidding film is electrically conductive;

(b) providing a blister film, wherein said blister film is electrically insulating;

(c) forming one or more blister cavities in said blister film;

(d) attaching IC chip to said blister film;

(e) filling said blister cavities with product contents;

(f) sealing said lidding film onto said blister film

(g) electrically coupling said IC chip after step (e) to said patterned lidding film; and

(h) cutting said lidding film thereby separating said lidding film into two distinct electrically conductive regions.

26. A method for fabricating a blister package with integrated electronic tag and antenna, said blister package comprising a formed blister film, IC chip, and lidding film, the method comprising:

(a) providing a lidding film, wherein said lidding film is electrically conductive;

(b) providing a blister film, wherein said blister film is electrically insulating;

(c) forming one or more blister cavities in said blister film;

(d) filling said blister cavities with product contents;

(e) sealing said lidding film onto a portion of said blister film; and

(f) attaching an electronic tag assembly to the sealed blister package.

27. The method of claim 26, wherein the step (f) involves depositing an electrically conductive pattern onto said blister film, and attaching the IC chip.