LED strip light lamp assembly

• US 20060202850A1
• Filed: 02/14/2006
• Published: 09/14/2006
• Est. Priority Date: 02/14/2005
• Status: Active Grant

• Current Assignee: Truck-Lite Company LLC (Truck-Lite Holdings 2 Corp.)
• Original Assignee: Truck-Lite Company LLC (Truck-Lite Holdings 2 Corp.)
• Inventors: Hefright, Craig, Kolstee, Todd, DiPenti, Timothy
• Granted Patent: US 8,305,225 B2
• Time in Patent Office: Days
• US Class Current: 340/815.450
• CPC Class Codes: B60Q 1/2696 Mounting of devices using LEDs
• CPC Class Codes: B60Q 1/32 for indicating vehicle sides , e.g. clearance lights
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder

Abstract

A lamp assembly to be incorporated into or positioned on a truck'"'"'s existing support structure comprising: a heat sink; an electrically insulating dielectric coating disposed on the heat sink; a plurality of circuit traces disposed on the dielectric coating; a plurality of LEDs disposed on and electrically connected to one another by the dielectric coating; and a cover disposed substantially over and protecting the heat sink, the dielectric coating, the circuit traces, and the LEDs. The LEDs are spaced apart at intervals to provide general illumination. The cover can be clear or be solid and have a plurality of apertures, each corresponding to one LED, and can further include a lens over the apertures.

Claims

1. A lamp assembly comprising:

a heat sink;

an electrically insulating dielectric coating disposed on said heat sink;

a plurality of circuit traces disposed on said dielectric coating;

a plurality of light emitting diodes electrically connected to one another by said plurality of circuit traces; and

a cover disposed substantially over and protecting said heat sink, said dielectric coating, said plurality of circuit traces, and said plurality of light emitting diodes;

wherein said lamp assembly is at least partially recessed within a support structure, said lamp assembly adapted to be electrically connected to a power source.

2. The lamp assembly of claim 1, wherein said heat sink is made of a material selected from a group consisting of aluminum, aluminum alloys, steel, stainless steel, copper, and combinations thereof.

3. The lamp assembly of claim 1, wherein said dielectric coating is a polymer/ceramic blend.

4. The lamp assembly of claim 1, wherein said dielectric coating is applied with a thixotropic material by screen printing.

5. The lamp assembly of claim 1, wherein said dielectric coating is between approximately one thousand microns and approximately ten microns thick.

6. The lamp assembly of claim 1, wherein said plurality of circuit traces are formed by a method selected from a group consisting of painting and dipping.

7. The lamp assembly of claim 1, wherein said plurality of circuit traces are disposed only over predetermined routes.

8. The lamp assembly of claim 1, wherein said plurality of circuit traces are comprised of a polymeric material having metal particles dispersed therein.

10. The lamp assembly of claim 8, wherein said metal particles dispersed in said polymeric material are selected from a group consisting of silver, gold, copper, silver, nickel, and alloys thereof.

11. The lamp assembly of claim 1, wherein each of said plurality of light emitting diodes is selected from a group consisting of Luxeon 1W emitter diodes, Luxeon 3W emitter diodes, 1W Jupiter diodes, 1W XLamp diodes, 1W Golden Dragon diodes, and Super-Flux HPA ⅛

W diodes.

12. The lamp assembly of claim 1, wherein each light emitting diode of said plurality of light emitting diodes is separated from each adjacent light emitting diode of said plurality of light emitting diodes by approximately one inch to six inches.

13. The lamp assembly of claim 1, wherein said cover includes at least one aperture corresponding to at least one light emitting diode of said plurality of light emitting diodes.

14. The lamp assembly of claim 1, wherein said cover is made of a substantially clear material selected from a group consisting of a polycarbonate and an acrylic plastic.

15. The lamp assembly of claim 1, wherein said cover is secured to said heat sink by fasteners, an adhesive, an epoxy, or a mechanical engagement such as a snap fit, an interference fit, or a locking mechanism between two extruded shapes.

16. The lamp assembly of claim 1, wherein said cover includes a lens such that light emitted from said plurality of light emitting diodes is redirected to be more evenly distributed as it passes through said cover.

17. The lamp assembly of claim 1, wherein said support structure functions as said cover.

9. The lamp assembly of cliam 8, wherein said polymeric material is selected from a group consisting of epoxy and phenolic resin.

18. An electrically driven light emitting diode lamp assembly comprising:

an electrically and thermally conductive and entirely metal heat sink;

an electrically insulating coating disposed over said heat sink, said coating being less than approximately one thousand microns thick;

a plurality of circuit traces disposed along said coating, said plurality of circuit traces being spaced apart to prevent electrical conduction directly between each trace of said plurality of traces;

a plurality of light emitting diodes in electrical connection to one another by said plurality of circuit traces, each light emitting diode of said plurality of light emitting diodes having at least one electrical lead for providing an electrical connection to one or more of said plurality of circuit traces and secured to one of said plurality of circuit traces via an electrically conductive adhesive layer; and

a cover, said cover being disposed substantially over and protecting said heat sink, said coating, said plurality of circuit traces, and said plurality of light emitting diodes;

wherein said assembly is adapted to be electrically connected to a power source and is installed directly within a support structure to provide general illumination.

19. The lamp assembly of claim 18, wherein said heat sink is made of a material selected from a group consisting of aluminum, aluminum alloys, steel, stainless steel, copper, and combinations thereof.

20. The lamp assembly of claim 18, wherein said coating is made of a polymer/ceramic blend.

21. The lamp assembly of claim 18, wherein said coating is applied with a thixotropic material by screen printing.

22. The lamp assembly of claim 18, wherein said plurality of circuit traces are formed by a method selected from a group consisting of painting and dipping.

23. The lamp assembly of claim 18, wherein said plurality of circuit traces are disposed only over predetermined routes.

24. The lamp assembly of claim 18, wherein said plurality of circuit traces are comprised of a polymeric material having metal particles dispersed therein, said polymeric material being selected from a group consisting of an epoxy and a phenolic resin, and wherein said metal particles dispersed therein are selected from a group consisting of silver, gold, copper, silver, nickel, and alloys thereof.

25. The lamp assembly of claim 18, wherein each of said plurality of LEDs is selected from a group consisting of Luxeon 1W emitter diodes, Luxeon 3W emitter diodes, 1W Jupiter diodes, 1W XLamp diodes, 1W Golden Dragon diodes, and Super-Flux HPA ⅛

W diodes.

26. The lamp assembly of claim 18, wherein each light emitting diode of said plurality of light emitting diodes is separated from each adjacent light emitting diode of said plurality of light emitting diodes by approximately one to six inches.

27. The lamp assembly of claim 18, wherein said cover is made of a substantially clear material selected from a group consisting of a polycarbonate and an acrylic plastic.

28. The lamp assembly of claim 18, wherein said cover includes at least one aperture corresponding to at least one light emitting diode of said plurality of light emitting diodes

29. The lamp assembly of claim 18, wherein said cover is secured to said heat sink by fasteners, an adhesive, an epoxy, or a mechanical engagement such as a snap fit, an interference fit, or a locking mechanism between two extruded shapes.

30. The lamp assembly of claim 18, wherein said cover includes a lens such that light emitted from said plurality of light emitting diodes is redirected to be more evenly distributed as it passes through said cover.

31. The lamp assembly of claim 18, wherein said support structure functions as said cover.

32. A lamp assembly comprising:

a heat sink, said heat sink being made of an electrically and thermally conductive material;

an electrically insulating dielectric coating disposed on said heat sink, said dielectric coating being between approximately ten and one-thousand microns thick;

a plurality of circuit traces disposed on said dielectric coating;

a plurality of light emitting diodes electrically connected to each other by said plurality of circuit traces, each light emitting diode of said plurality of light emitting diodes being spaced from each adjacent light emitting diode of said plurality of light emitting diodes by approximately one to six inches, each light emitting diode of said plurality of light emitting diodes having at least one electrical lead for providing an electrical connection to one or more of said plurality of circuit traces and being secured to one of said plurality of circuit traces by an electrically conductive adhesive; and

a cover disposed substantially over and protecting said heat sink, said dielectric coating, said plurality of circuit traces, and said plurality of light emitting diodes;

wherein said lamp assembly is at least partially recessed within a support structure and adapted to be electrically connected to a power source.

33. The lamp assembly of claim 32, wherein said heat sink is made of a material selected from a group consisting of aluminum, aluminum alloys, steel, stainless steel, copper, and combinations thereof.

34. The lamp assembly of claim 32, wherein said dielectric coating is made of a polymer/ceramic blend.

35. The lamp assembly of claim 32, wherein said dielectric coating is applied with a thixotropic material by screen printing.

36. The lamp assembly of claim 32, wherein said plurality of circuit traces are formed by painting or dipping.

37. The lamp assembly of claim 32, wherein said plurality of circuit traces are disposed only over predetermined routes.

38. The lamp assembly of claim 32, wherein said plurality of circuit traces are comprised of a polymeric material having metal particles dispersed therein, said polymeric material being selected from a group consisting of an epoxy and a phenolic resin, and wherein said metal particles dispersed therein are selected from a group consisting of silver, gold, copper, silver, nickel, and alloys thereof.

39. The lamp assembly of claim 32, wherein each of said plurality of light emitting diodes is selected from a group consisting of Luxeon 1W emitter diodes, Luxeon 3W emitter diodes, 1W Jupiter diodes, 1W XLamp diodes, 1W Golden Dragon diodes, and Super-Flux HPA ⅛

W diodes.

40. The lamp assembly of claim 32, wherein said cover is made of a substantially clear material selected from a group consisting of a polycarbonate and an acrylic plastic.

41. The lamp assembly of claim 32, wherein said cover is secured to said heat sink by fasteners, an adhesive, an epoxy, or a mechanical engagement such as a snap fit, an interference fit, or a locking mechanism between two extruded shapes.

42. The lamp assembly of claim 32, wherein said support structure further acts as said cover, said support structure including at least one aperture corresponding to at least one light emitting diode of said plurality of light emitting diodes.

43. The lamp assembly of claim 32, wherein said cover includes a lens, such that light emitted from said plurality of light emitting diodes is redirected to be more evenly distributed as it passes through said cover.

44. A system for illuminating comprising:

a support structure; and

a lamp assembly, said lamp assembly including;

a heat sink;

an electrically insulating dielectric coating disposed on said heat sink;

a plurality of circuit traces disposed on said dielectric coating;

a plurality of light emitting diodes electrically connected to one another by said plurality of circuit traces; and

wherein said lamp assembly is at least partially recessed within said support structure such that said support structure functions as a cover disposed substantially over and protecting said heat sink, said dielectric coating, said plurality of circuit traces, and said plurality of light emitting diodes, said support structure having at least one aperture formed therein to allow light from said plurality of light emitting diodes to be emitted.

45. The system of claim 44, wherein said lamp assembly is adapted to be electrically connected to a power source within a truck.

46. The system of claim 44, wherein said heat sink is made of a material selected from a group consisting of aluminum, aluminum alloys, steel, stainless steel, copper, and combinations thereof.

47. The system of claim 44, wherein said dielectric coating is made of a polymer/ceramic blend.

48. The system of claim 44, wherein said dielectric coating is applied with a thixotropic material by screen printing.

49. The system of claim 44, wherein said dielectric coating is between approximately ten and one-thousand microns thick.

50. The system of claim 44, wherein said plurality of circuit traces are formed by painting or dipping.

51. The system of claim 44, wherein said plurality of circuit traces are disposed only over predetermined routes.

52. The system of claim 44, wherein said plurality of circuit traces are comprised of a polymeric material having metal particles dispersed therein, said polymeric material being selected from a group consisting of an epoxy and a phenolic resin, and wherein said metal particles dispersed therein are selected from a group consisting of silver, gold, copper, silver, nickel, and alloys thereof.

53. The system of claim 44, wherein each of said plurality of LEDs is selected from a group consisting of Luxeon 1W emitter diodes, Luxeon 3W emitter diodes, 1W Jupiter diodes, 1W XLamp diodes, 1 W Golden Dragon diodes, and Super-Flux HPA ⅛

W diodes.

54. The system of claim 44, wherein said lamp assembly further includes a lens so that light emitted from said plurality of light emitting diodes is redirected to be more evenly distributed.