Particle detection method

• US 20060203234A1
• Filed: 05/09/2006
• Published: 09/14/2006
• Est. Priority Date: 09/18/2003
• Status: Active Grant

• Current Assignee: Terry L. Gilton
• Original Assignee: Terry L. Gilton
• Inventors: Gilton, Terry L.
• Granted Patent: US 7,239,381 B2
• Time in Patent Office: Days
• US Class Current: 356/237.200
• CPC Class Codes: G01N 21/77 by observing the effect on a chemical indicator
• CPC Class Codes: G01N 21/94 Investigating contamination, e.g. dust G01N21/85 takes precedence
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10

Abstract

A method for detecting on a substrate used in the fabrication of integrated devices comprises the steps of (1) contacting the substrate with a monomer, wherein the particle catalyzes the polymerization of the monomer, and (2) detecting the particle using a particle counter. Different types of particles may be distinguished through their different polymerization rates of the monomer. Accordingly, in some certain embodiments, steps (1) and (2) may be repeated, allowing the growth rates of the particles to be determined. A plurality of monomers may be employed to identify different types of particles on the same substrate. The method is useful in detecting copper particles on silicon substrates.

Claims

1. A method for detecting a particle on a substrate used in integrated device fabrication, the method comprising:

obtaining a first particle detection on the substrate;

contacting the substrate with a first monomer, wherein the particle catalyzes the polymerization of the first monomer;

obtaining a second particle detection on the substrate; and

comparing the results of the particle detection steps to detect the particle.

2. The method of claim 1, wherein the composition of the particle is identified as a first type of particle, which catalyzes the first type of monomer.

3. The method of claim 2, wherein the composition of the particle is identified by the polymerization rate.

4. The method of claim 2, wherein the composition of the particle is identified as a first type of particle, which does not catalyze the first type of monomer.

5. The method of claim 2, wherein the compositions of plurality of types of particles are identified through their different rates of polymerization of the monomer.

6. The method of claim 2, further comprising:

contacting the substrate with a second monomer, wherein a second type of particle catalyzes the polymerization of the second monomer;

obtaining a third particle detection on the substrate; and

comparing the results of the particle detection steps to identify the second type of particle.

7. The method of claim 6, further comprising repeating the contacting, obtaining, and comparing steps to identify further types of particles.

8. The method of claim 1, wherein the particle counter detects a property selected from the group consisting of number of particles, sizes of the particles, positions of the particles, and combinations thereof.

9. The method of claim 1, wherein the particle counter is capable of detecting particles on both sides of the substrate without unmounting the substrate.

10. The method of claim 1, wherein the particle counter detects particles optically.

11. The method of claim 10, wherein the optical scanner is a laser scanner.

12. The method of claim 10, wherein the particle counter detects a property selected from the group consisting of absorbance, fluorescence, reflectance, refractive index, and polarization.

13. The method of claim 3, wherein the monomer is polymerized by a plurality of particle types.

14. The method of claim 1, wherein the substrate is contacted with a plurality of monomers.

15. The method of claim 14, wherein a plurality of monomers contact the substrate simultaneously.

16. The method of claim 14, wherein a plurality of monomers contact the substrate sequentially.

17. The method of claim 1, wherein the particle is a metal.

18. The method of claim 17, wherein the metal is copper.

19. The method of claim 1, wherein the substrate comprises silicon.

20. The method of claim 19, wherein the substrate comprises a single crystal silicon wafer.

21. The method of claim 1, wherein the monomer is in the vapor phase.

22. The method of claim 1, wherein the monomer is an alkene.

23. The method of claim 22, wherein the alkene is selected from the group consisting of styrene, methyl acrylate, ethyl acrylate, methyl methacrylate, and acrylonitrile..

24. The method of claim 1, wherein the monomer is selected from the group consisting of aniline and thiophene.

25. The method of claim 1, further comprising an initiator.

26. The method of claim 25, wherein the initiator is benzyl bromide.

27. The method of claim 1, wherein the substrate is irradiated with electromagnetic radiation.