COMPACT CAMERA MODULE WITH REDUCED THICKNESS

• US 20060219862A1
• Filed: 03/31/2005
• Published: 10/05/2006
• Est. Priority Date: 03/31/2005
• Status: Abandoned Application

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Chen, Kuo-Ming, Ho, Kai-Kuang
• Application Number:
  US10/907,403
• Publication Number:
  US 20060219862A1
• Time in Patent Office: Days
• US Class Current: 250/208.100
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A compact camera module (CCM) assembly includes a flexible printed circuit board and a packaging substrate mounted at one end of the flexible printed circuit board. The packaging substrate has a cavity. An image signal processor chip is directly mounted on the flexible printed circuit board within the cavity of the packaging substrate. An image sensor chip is stacked on the image signal processor chip. The image sensor chip and the image signal processor are electrically connected to circuit of the packaging substrate via gold wires formed by wire bonding. A lens holder seals the image signal processor chip and image sensor chip. A lens array is disposed on the lens holder and is situated a fixed distance from the image sensor chip.

Claims

1. A compact camera module (CCM) assembly comprising:

a flexible printed circuit board;

a packaging substrate mounted at one end of the flexible printed circuit board, said packaging substrate has a recessed area;

an image signal processor chip directly mounted on said flexible printed circuit board within said recessed area of said packaging substrate;

an image sensor chip stacked on said image signal processor chip, wherein said image sensor chip is electrically connected to circuit of said packaging substrate via gold wires formed by wire bonding;

a lens holder sealing said image signal processor chip and said image sensor chip; and

a lens array disposed on said lens holder and being situated a fixed distance from said image sensor chip.

2. The compact camera module assembly according to claim 1 further comprises an IR filter interposed between said lens array and said image sensor chip.

3. The compact camera module assembly according to claim 1 wherein said image sensor chip is a CMOS image sensor.

4. The compact camera module assembly according to claim 1 wherein said image signal processor chip is electrically connected to said packaging substrate via wire bonding.

5. The compact camera module assembly according to claim 1 wherein said image signal processor chip is electrically connected to said flexible printed circuit board via flip chip technology.

6. The compact camera module assembly according to claim 1 further comprises a connector device mounted on the other end of said flexible printed circuit board for connecting with control circuit or power of a portable device.

7. A compact camera module (CCM) assembly comprising:

a flexible printed circuit board;

a packaging substrate mounted at one end of the flexible printed circuit hoard, said packaging substrate has a recessed area;

an image signal processor chip directly mounted on said flexible printed circuit board within said recessed area of said packaging substrate;

a spacer layer on said image signal processor chip;

an image sensor chip stacked on said spacer layer, wherein said image sensor chip and said image signal processor chip are electrically connected to circuit of said packaging substrate via gold wires formed by wire bonding;

a lens holder sealing said image signal processor chip and said image sensor chip; and

a lens array disposed on said lens holder and being situated a fixed distance from said image sensor chip.

8. The compact camera module assembly according to claim 7 further comprises an IR filter interposed between said lens array and said image sensor chip.

9. The compact camera module assembly according to claim 7 wherein said image sensor chip is a CMOS image sensor.

10. The compact camera module assembly according to claim 7 wherein said spacer layer is a silicon layer.