Transferring die(s) from an intermediate surface to a substrate

• US 20060225273A1
• Filed: 03/29/2005
• Published: 10/12/2006
• Est. Priority Date: 03/29/2005
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Application Number:
  US11/091,944
• Publication Number:
  US 20060225273A1
• Time in Patent Office: Days
• US Class Current: 29/834
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

Dies that are attached to a die plate can be transferred to a substrate. For example, holes in the die plate can be filled with an expandable material. A stimulus source, such as a laser beam/laser light can be directed to the material in a hole, causing the material to expand. Expansion of the material can cause a die that is covering the hole to be released from the die plate to come into contact with a substrate. A mask can be used to prevent the material in a hole from being expanded by the stimulus source. In another example, a pin plate is used to release a die from the die plate. Pins of the pin plate are selectively actuated to cause selected die(s) to be released. An actuator plate having a plurality of actuators can be moved across the pin plate, with actuator(s) selectively actuating corresponding pin(s).

Claims

1. A method for transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:

(a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a corresponding hole through the die plate;

(b) positioning a transparent planar body against a second surface of the die plate;

(c) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and

(d) applying a stimulus through the transparent planar body to a material filling the hole in the die plate to cause the die to be released from the die plate to come into contact with the contact area.

2. The method of claim 1, wherein the stimulus is selectively applied through the transparent planar body.

3. The method of claim 2, further comprising:

(e) covering another hole in the die plate using a mask.

4. The method of claim 1, wherein step (a) includes:

receiving the die plate having the hole empty;

filling the empty hole with the material; and

positioning the die onto the first surface of the die plate over the hole filled with the material.

5. The method of claim 1, wherein step (a) includes:

receiving the die plate having the hole empty;

positioning the die onto the first surface of the die plate over the empty hole; and

filling the empty hole with the material.

6. The method of claim 1, wherein step (a) includes:

receiving the die plate having a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therethrough, wherein each die of the plurality of dies covers a corresponding hole through the die plate.

7. The method of claim 6, further comprising:

(e) repeating step (d) on each die of the plurality of dies to cause each die to be released from the die plate to come into contact with a corresponding contact area on the substrate.

8. The method of claim 1, wherein step (d) includes:

using a laser to heat the material through the transparent planar body to cause the material to expand, thereby causing the die to be released from the die plate.

9. A system for transferring integrated circuit dies, comprising:

a die plate holder configured to mount a die plate, said die plate having a first surface having a die attached thereto, wherein the die covers a corresponding hole through the die plate;

a transparent planar body configured to be positioned against a second surface of the die plate;

a substrate supply configured to present a substrate, wherein the die plate holder is further configured to position the first surface of the die plate adjacent to the substrate such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and

a stimulus source configured to apply a stimulus through the transparent planar body to a material filling the hole in the die plate to cause the die to be released from the die plate to come into contact with the contact area.

10. The system of claim 9, wherein the stimulus source is a laser.

11. The system of claim 9, wherein said die plate has a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therethrough, wherein each die of the plurality of dies covers a corresponding hole through the die plate, wherein the material fills each hole in the die plate;

wherein said stimulus source is configured to apply a stimulus through the transparent planar body to the material filling each hole in the die plate to cause each die to be released from the die plate to come into contact with a corresponding contact area of the substrate.

12. A method of transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:

(a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a corresponding hole in the die plate;

(b) aligning a pin with the hole in the die plate;

(c) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and

(d) selectively actuating the pin to cause the die to be released from the die plate to come into contact with the contact area.

13. The method of claim 12, wherein step (a) includes:

receiving the die plate having a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therein, wherein each die of the plurality of dies covers a corresponding hole in the die plate.

14. The method of claim 12, wherein step (d) includes:

selectively energizing a coil associated with the pin to move the pin into the hole in the die plate.

15. The method of claim 12, wherein step (d) includes:

moving an actuator plate having a plurality of actuators across a pin plate holding the pin, wherein a corresponding actuator selectively actuates the pin.

16. A system to transfer integrated circuit dies, comprising:

a die plate holder to mount a die plate, said die plate having a first surface having a die attached thereto, wherein the die covers a corresponding hole in the die plate;

a pin plate holder to align a pin of a pin plate with the hole in the die plate;

a substrate supply to present a substrate; and

an actuator to selectively actuate the pin to cause the die to be released from the die plate to come into contact with a contact area on a first surface of the substrate.

17. The system of claim 16, wherein said die plate has a plurality of dies attached to the first surface of the die plate, the die plate having a plurality of holes therein, wherein each die of the plurality of dies covers a corresponding hole in the die plate.

18. The system of claim 16, wherein the actuator includes a coil.

19. The system of claim 16, wherein the pin plate holder moves the pin plate across the die plate to selectively move pins of the pin plate into holes of the die plate.

20. The system of claim 16, wherein the pin plate includes at least a portion of the actuator.