Heating apparatus and driving method therefor

• US 20060237421A1
• Filed: 04/05/2006
• Published: 10/26/2006
• Est. Priority Date: 04/07/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Dong-woo, Kim, Tae-gyu, Lee, Bang-weon, Lee, Jin-sung
• Application Number:
  US11/397,604
• Publication Number:
  US 20060237421A1
• Time in Patent Office: Days
• US Class Current: 219/388
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: F27B 5/04 adapted for treating the charge in vacuum or special atmosphere
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A heating apparatus and a method of driving the same. The heating apparatus includes: a heating plate on which an object to be heated is loaded and which is partitioned into a plurality of heating zones; a main heating apparatus that is placed on a lower portion of the heating plate and uniformly heats the entire heating plate; and a plurality of subheaters located below the heating plate and disposed to respectively correspond to the heating zones, such that each of the subheaters heats a corresponding one of the heating zones.

Claims

1. A heating apparatus comprising:

a heating plate on which an object to be heated is loaded and which is partitioned into a plurality of heating zones;

a main heating apparatus that is placed on a lower portion of the heating plate and uniformly heats the entire heating plate; and

a plurality of subheaters located below the heating plate and disposed to respectively correspond to the heating zones, such that each of the subheaters heats a corresponding one of the heating zones.

2. The heating apparatus of claim 1, further comprising a plurality of temperature sensors detecting a temperature of each of the heating zones.

3. The heating apparatus of claim 1, wherein the subheaters are placed on a lower portion of the main heating apparatus.

4. The heating apparatus of claim 3, wherein an insulating layer is formed between the main heating apparatus and the subheaters.

5. The heating apparatus of claim 1, wherein the heating plate is formed of ceramics or a metal.

6. A driving method for the heating apparatus of claim 1, comprising:

setting a target temperature for each of the heating zones of the heating plate;

driving the main heating apparatus to uniformly heat the entire heating plate;

sensing an actual temperature of each of the heating zones of the heating plate and comparing it with the target temperature ; and

driving the subheaters corresponding to each of the heating zones having a temperature difference with respect to the actual temperature and the target temperature to heat the heating zones to the target temperature.

7. The driving method of 6, wherein the main heating apparatus heats the heating plate to the lowest target temperature set for the heating zones.