HIGH POWER RADIATION EMITTER DEVICE AND HEAT DISSIPATING PACKAGE FOR ELECTRONIC COMPONENTS

• US 20060244118A1
• Filed: 06/27/2006
• Published: 11/02/2006
• Est. Priority Date: 01/31/2001
• Status: Active Grant

• Current Assignee: Gentex Corporation
• Original Assignee: Gentex Corporation
• Inventors: Roberts, John K., Reese, Spencer D.
• Granted Patent: US 7,489,031 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity

Abstract

The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.

Claims

1. A package for at least one electronic semiconductor component, said package comprising:

first and second substrates sealed together and spaced apart to define a sealed chamber;

a liquid or gel contained in said sealed chamber; and

at least one electronic semiconductor component disposed in said sealed chamber in thermal contact with said liquid or gel.

2. The electronic component package of claim 1, wherein said first and second substrates are printed circuit boards.

3. The electronic component package of claim 1, wherein said second substrate is substantially opaque.

4. The electronic component package of claim 1, wherein said second substrate is substantially transparent.

5. The electronic component package of claim 1, wherein said at least one electronic component includes a radiation emitting device.

6. The electronic component package of claim 1, wherein said at least one electronic component includes an optical sensor.

7. The electronic component package of claim 1, wherein said at least one electronic component includes a microprocessor.

8. The electronic component package of claim 1, wherein said second substrate has a high thermal conductivity.

9. The electronic component package of claim 1, wherein said first substrate is a printed circuit board.

10. The electronic component package of claim 9, wherein a portion of said first circuit board extends outward from said sealed chamber, said portion including at least one electrical contact electrically coupled to at least one of said electronic components disposed in said sealed chamber.

11. The electronic component package of claim 10, wherein said electrical contact is configured to contact a corresponding electrical contact in an edge connector.

12. The electronic component package of claim 1, wherein said second substrate is a heat sink having a large outer surface area.

13. The electronic component package of claim 12, wherein said heat sink has a plurality of fins extending away from said sealed chamber.

14. The electronic component package of claim 12, wherein said heat sink has a plurality of passageways through which liquid may flow.

15. The electronic component package of claim 14, wherein said passageways open into said sealed chamber such that said liquid in said sealed chamber may flow through said passageways.

16. A package for at least one electronic component, said package comprising:

a circuit board and a substrate, sealed together and spaced apart to define a sealed chamber;

a liquid or gel contained in said sealed chamber; and

at least one electronic component mounted on said circuit board and disposed in said sealed chamber in thermal contact with said liquid or gel.

17. The electronic component package of claim 16, wherein said substrate is substantially opaque.

18. The electronic component package of claim 16, wherein said substrate is substantially transparent.

19. The electronic component package of claim 16, wherein said at least one electronic component includes a radiation emitting device.

20. The electronic component package of claim 16, wherein said at least one electronic component includes an optical sensor.

21. The electronic component package of claim 16, wherein said at least one electronic component includes a microprocessor.

22. The electronic component package of claim 16, wherein said at least one electronic component includes a resistor.

23. The electronic component package of claim 16, wherein said second substrate has a high thermal conductivity.

24. The electronic component package of claim 16, wherein said at least one electronic component includes a semiconductor component.