Abrasive tool and method of making the same

• US 20060254154A1
• Filed: 05/12/2005
• Published: 11/16/2006
• Est. Priority Date: 05/12/2005
• Status: Abandoned Application

• Current Assignee: Kinik Company
• Original Assignee: Kinik Company
• Inventors: Huang, Wei, Yang, Ming-Ta, Lin, Ping-Han
• Application Number:
  US11/127,085
• Publication Number:
  US 20060254154A1
• Time in Patent Office: Days
• US Class Current: 51/293
• CPC Class Codes: B24B 7/228 for grinding thin, brittle parts, e.g. semiconductors, wafers grinding edges of thin, brittle parts B24B9/065
• CPC Class Codes: B24D 18/00 Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
• CPC Class Codes: B24D 7/02 Wheels in one piece

Abstract

An abrasive tool includes a substrate, a plurality of abrasive particle groups, and a bonding layer. The abrasive particle group consists of a plurality of abrasive particles grouped together. The abrasive particle groups are disposed in a regular pattern on the surface of the substrate and fixed on the surface by the bonding layer. To control the disposition of the abrasive particle groups, an abrasive particle template is used to form the required pattern. The size of the abrasive particle positioning holes on the template is used to adjust the number of particles in an abrasive particle group.

Claims

1. An abrasive tool, comprising:

a substrate;

a plurality of abrasive particle groups disposed in a regular pattern on a surface of the substrate, each of the abrasive particle groups consisting of a plurality of abrasive particles, the pitch of the abrasive particle groups being below 700 μ

m, each of the abrasive particle groups containing 2 to 8 abrasive particles; and

a bonding layer for fixing the abrasive particles on the substrate.

2. The abrasive tool of claim 1, wherein the abrasive particles are diamond particles.

3. The abrasive tool of claim 2, wherein the average particle size of the diamond particles is between 100 μ

m and 220 μ

m.

4. The abrasive tool of claim 2, wherein the size of the diamond particles is selected from the group consisting of US mesh #70/75 (average particle size ˜

210 μ

m), #80/90 (average particle size ˜

180 μ

g m), #100/120 (average particle size ˜

150 μ

m), #120/140 (average particle size ˜

125 μ

m), and #140/170 (average particle size ˜

110 μ

m).

5. The abrasive tool of claim 1, wherein the bonding layer is selected from the group consisting of metal, ceramic, and polymer bonding agents.

6. The abrasive tool of claim 3, wherein the metal bonding layer is formed by brazing a Ni—

Cr alloy material.

7. The abrasive tool of claim 3, wherein the polymer bonding layer is selected from the group consisting of a room-temperature curing resin, a thermal curing resin, and a photo-curing resin.

13. The method of claim 6, wherein the bonding layer is selected from the group consisting of a metal brazing material, a metal electroplating layer, a ceramic bonding agent, and a polymer bonding agent.

8. A method of making an abrasive tool, comprising the steps of:

providing a substrate on which surface has a bonding layer;

providing an abrasive particle disposition template with a plurality of abrasive particle positioning holes disposed in a regular pattern, the pitch of the abrasive particle positioning holes being below 700 microns;

aligning and stacking the abrasive particle disposition template on the surface of the substrate;

filling abrasive particles in the abrasive particle positioning holes to form a plurality of abrasive particle groups, the diameter of the abrasive particle positioning holes being between 1.75 and 2.5 times the average particle size of the abrasive particles;

separating the abrasive particle disposition template; and

fixing the plurality of abrasive particles on the surface of the substrate by the bonding layer.

9. The method of claim 8, wherein each of the abrasive particle groups contains 2 to 8 abrasive particles.

10. The method of claim 9, wherein the abrasive particles are diamond particles.

11. The method of claim 10, wherein the average particle size of the diamond particles is between 100 μ

m and 220 μ

m.

12. The method of claim 10, wherein the size of the diamond particles is selected from the group consisting of US mesh #70/75 (average particle size 210 μ

m), #80/90 (average particle size ˜

180 μ

m), #100/120 (average particle size ˜

150 μ

m), #120/140 (average particle size ˜

125 μ

m), and #140/170 (average particle size ˜

110 μ

m).

14. The method of claim 10, wherein the metal brazing material is a Ni—

Cr alloy material.

15. The method of claim 10, wherein the polymer bonding layer is selected from the group consisting of a room-temperature curing resin, a thermal curing resin, and a photo-curing resin.

16. A method of making an abrasive tool, comprising the steps of:

providing a substrate;

forming a brazing material on a surface of the substrate;

distributing a plurality of abrasive particle groups on the brazing material in a regular pattern, the pitch between the abrasive particle groups being below 700 microns and each of the abrasive particle groups containing 2 to 8 abrasive particles; and

fixing the abrasive particles on the surface of the substrate by brazing.

17. The method of claim 16, wherein the abrasive particles are diamond particles.

18. The method of claim 17, wherein the average particle size of the diamond particles is between 100 μ

m and 220 μ

m.

19. The method of claim 18, wherein the size of the diamond particles is selected from the group consisting of US mesh #70/75 (average particle size ˜

210 μ

m), #80/90 (average particle size ˜

180 μ

m), #100/120 (average particle size ˜

150 μ

m), #120/140 (average particle size ˜

125 μ

m), and #140/170 (average particle size ˜

110 μ

m).