Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

• US 20060264106A1
• Filed: 02/27/2004
• Published: 11/23/2006
• Est. Priority Date: 03/11/2003
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: ADC GmbH (TE Connectivity Ltd. (United Kingdom))
• Inventors: Hetzer, Ulrich, Bresche, Peter
• Granted Patent: US 7,401,402 B2
• Time in Patent Office: Days
• US Class Current: 439/620.90
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6473 Impedance matching
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2203/171 Tuning, e.g. by trimming of printed components or high frequency circuits
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: Y10S 439/941 Crosstalk suppression
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49135 and shaping, e.g., cutting or bending, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact point for the high-frequency contacts is connected to one respective contact point for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path, which is connected on only one side to a contact point of an electrical contact, is situated on the printed circuit board that, together with at least one second conductor path, which is situated on and/or in the printed circuit board, forms a capacitor. At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path that is contacted on one side is partially removed or completely separated.

Claims

1. A method for RF matching of an RF plug connector, having a printed circuit board, with the printed circuit board having contact points for RF contacts and contact points for insulation-displacement contacts, with one contact point for the RF contacts in each case being connected to a respective contact point for the insulation-displacement contacts, with the capacitive coupling, which causes near-end crosstalk, occurring between the RF contacts, wherein at least one first conductor track, which is connected on only one side to a contact point of an electrical contact, is arranged on the printed circuit board and, together with at least one second conductor track which is arranged on and/or in the printed circuit board, forms a capacitor, with at least one frequency-dependent parameter of the arrangement being measured, the frequency-dependent parameter being compared with a nominal parameter, and the conductor track with which contact is made on one side being partially removed or cut through as a function of the difference.

2. The method as claimed in claim 1, wherein the second conductor track is in the form of a conductor track with which contact is made on one side.

3. The method as claimed in claim 1, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board and is connected to the second conductor track that is arranged on the printed circuit board.

4. The method as claimed in claim 1, wherein at least two matchable capacitors are arranged on the printed circuit board.

5. The method as claimed in claim 1, wherein the frequency-dependent parameters are determined on the unpopulated printed circuit board.

6. The method as claimed in claimed claim 1, wherein in a first step, only a portion of the estimated conductor track shortening that is necessary is carried out, the frequency-dependent parameter is measured once again, and the remaining conductor track length which is still to be removed or to be cut is determined from this.

7. The method as claimed in claim 6, wherein, in the final step, the conductor track is cut in a broader manner than in the first step.

8. The method as claimed in claim 1, wherein near crosstalk is determined as the frequency-dependent parameter.

9. The method as claimed in claim 1, wherein the conductor track is cut by means of a laser.

10. The method as claimed in claim 9, wherein the process of controlling the laser is assisted by means of an optical system.

11. A printed circuit board for holding RF contacts and insulation-displacement contacts for an RF plug connector, with the printed circuit board having eight contact points for RF contacts and eight contact points for insulation-displacement contacts, with one contact point for the RF contacts in each case being connected to a respective contact point for the insulation-displacement contacts, and with capacitive coupling which causes near-end crosstalk occurring between the RF contacts, wherein at least one first conductor track, which is connected on only one side to a contact point of an electrical contact, is arranged on the printed circuit board and, together with at least one second conductor track which is arranged on and/or in the printed circuit board, forms a capacitor.

12. The printed circuit board as claimed in claim 11, wherein the second conductor track is likewise a conductor track which is connected to a contact point on one side.

13. The printed circuit board as claimed in claim 11, wherein at least one further second conductor track is arranged in an internal layer in the printed circuit board and is connected to the further conductor track that is arranged on the printed circuit board.

14. The printed circuit board as claimed in claim 11, wherein at least two matchable capacitors are arranged on the printed circuit board.

15. The printed circuit board as claimed in claim 11, wherein the first capacitor is arranged between the contact points, and the second capacitor is arranged between the contact points.