Electrode layer for capacitors, method of manufacturing the electrode layer, unit sensor using the electrode layer, and tactile sensor using the unit sensor

• US 20060267140A1
• Filed: 01/23/2006
• Published: 11/30/2006
• Est. Priority Date: 05/26/2005
• Status: Active Grant

• Current Assignee: Korea Advanced Institute of Science and Technology
• Original Assignee: Korea Advanced Institute of Science and Technology
• Inventors: Yoon, Euisik, Lee, Hyung-Kew, Yun, Kwang-Seok
• Granted Patent: US 7,692,255 B2
• Time in Patent Office: Days
• US Class Current: 257/532
• CPC Class Codes: G01L 1/146 for measuring force distributions, e.g. using force arrays G01L1/148 takes precedence
• CPC Class Codes: G01L 5/228 using tactile array force sensors
• CPC Class Codes: H01G 5/011 Electrodes
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes

Abstract

Disclosed herein are an electrode layer for capacitors, a method of manufacturing the electrode layer, a unit sensor using the electrode layer, and a tactile sensor using the unit sensor. The electrode layer comprises a polymer substrate, an electrode formed on the polymer substrate, and a signal transmission line formed on the polymer substrate such that the signal transmission line is connected to the electrode. The unit sensor comprises upper and lower electrode layers, which are identical to the above-described electrode, and a spacer layer made of polymer. According to the present invention, the sensor can be easily manufactured while the sensor has high flexibility and easy extensionabilty.

Claims

1. An electrode layer for capacitors whose capacitance is changed depending upon the variation in distance between two electrode layers, wherein the electrode layer comprises:

a polymer substrate;

an electrode formed on the polymer substrate; and

a signal transmission line formed on the polymer substrate such that the signal transmission line is connected to the electrode.

2. The electrode layer as set forth in claim 1, wherein the polymer is silicon-based rubber or polyimide.

3. A method of manufacturing the electrode layer for capacitors as set forth in claim 1, wherein the method comprises the steps of:

forming a sacrifice layer on a silicon substrate;

forming an electrode and a signal transmission line at a predetermined area on the sacrifice layer;

coating the sacrifice layer, on which the electrode and the signal transmission line are formed, with liquid-state polymer, and hardening the liquid-state polymer; and

removing the silicon substrate and the sacrifice layer.

4. The method as set forth in claim 3, wherein the electrode and the signal transmission line are formed by electroplating.

5. A unit sensor comprising:

an upper electrode layer including a polymer substrate, an upper electrode formed on the polymer substrate, and a signal transmission line formed on the polymer substrate such that the signal transmission line extends in the side-to-side direction of the upper electrode;

a lower electrode layer including a polymer substrate, a lower electrode formed on the polymer substrate, and a signal transmission line formed on the polymer substrate such that the signal transmission line extends in the front-to-rear direction of the lower electrode; and

a spacer layer, made of polymer, disposed between the upper electrode layer and the lower electrode layer, the spacer layer being provided at a predetermined area thereof with an opening, through which the upper electrode and the lower electrode face each other.

6. The unit sensor as set forth in claim 5, wherein the spacer layer is prepared by applying liquid-state polymer to a silicon substrate, hardening the liquid-state polymer, forming a pattern using photolithography, forming the opening using dry etching, and removing the silicon substrate.

7. The unit sensor as set forth in claim 5, further comprising:

an insulating layer, made of polymer, disposed between the upper electrode layer and the spacer layer.

8. The unit sensor as set forth in claim 5, further comprising:

an insulating layer, made of polymer, disposed between the lower electrode layer and the spacer layer.

9. The unit sensor as set forth in claim 7, wherein the insulating layer is prepared by applying liquid-state polymer to a silicon substrate, hardening the liquid-state polymer, and removing the silicon substrate.

10. The unit sensor as set forth in claim 5, further comprising:

a bump layer, made of polymer, disposed on the upper electrode layer.

11. The unit sensor as set forth in claim 10, wherein the bump layer is prepared by applying liquid-state polymer to a silicon substrate, on which a bump mold is formed, hardening the liquid-state polymer, and removing the silicon substrate.

12. The unit sensor as set forth in claim 5, wherein the polymer is silicon-based rubber or polyimide.

13. A tactile sensor using the unit sensor as set forth in claim 5, wherein the tactile sensor comprises:

a unit sensor array including a plurality of unit sensors formed in a two-dimensional array, the upper electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the upper electrodes, the lower electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the lower electrodes; and

connection lines disposed at the ends of the signal transmission lines for the upper electrodes and the signal transmission lines for the lower electrodes to connect the unit sensor array to the outside.

14. The unit sensor as set forth in claim 8, wherein the insulating layer is prepared by applying liquid-state polymer to a silicon substrate, hardening the liquid-state polymer, and removing the silicon substrate.

15. The unit sensor as set forth in claim 7, wherein the polymer is silicon-based rubber or polyimide.

16. The unit sensor as set forth in claim 8, wherein the polymer is silicon-based rubber or polyimide.

17. The unit sensor as set forth in claim 10, wherein the polymer is silicon-based rubber or polyimide.

18. A tactile sensor using the unit sensor as set forth in claim 7, wherein the tactile sensor comprises:

a unit sensor array including a plurality of unit sensors formed in a two-dimensional array, the upper electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the upper electrodes, the lower electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the lower electrodes; and

connection lines disposed at the ends of the signal transmission lines for the upper electrodes and the signal transmission lines for the lower electrodes to connect the unit sensor array to the outside.

19. A tactile sensor using the unit sensor as set forth in claim 8, wherein the tactile sensor comprises:

a unit sensor array including a plurality of unit sensors formed in a two-dimensional array, the upper electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the upper electrodes, the lower electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the lower electrodes; and

connection lines disposed at the ends of the signal transmission lines for the upper electrodes and the signal transmission lines for the lower electrodes to connect the unit sensor array to the outside.

20. A tactile sensor using the unit sensor as set forth in claim 10, wherein the tactile sensor comprises:

a unit sensor array including a plurality of unit sensors formed in a two-dimensional array, the upper electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the upper electrodes, the lower electrodes of the unit sensors being electrically connected with each other by the sequential interconnection of the signal transmission lines for the lower electrodes; and

connection lines disposed at the ends of the signal transmission lines for the upper electrodes and the signal transmission lines for the lower electrodes to connect the unit sensor array to the outside.