Apparatuses and associated methods for improved solder joint reliability

• US 20060267217A1
• Filed: 05/27/2005
• Published: 11/30/2006
• Est. Priority Date: 05/27/2005
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Tay, Cheng Siew, Wong, Chee Wai
• Granted Patent: US 7,242,084 B2
• Time in Patent Office: Days
• US Class Current: 257/779
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10659 Different types of terminals for the same component, e.g. solder balls combined with leads
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.

Claims

1. An apparatus comprising:

a package substrate; and

one or more strengthening pin(s) coupled to the periphery of the package substrate, wherein the one or more strengthening pin(s) are coupled to the substrate using a socket on an end of the pin(s) to secure the pin(s) to the substrate by affixing the socket to an edge of the substrate, the strengthening pin(s) capable of coupling to a circuit board.

2. An apparatus according to claim 1, wherein the one or more strengthening pin(s) are coupled to a circuit board.

5. An apparatus according to claim 1, wherein the one or more strengthening pin(s) protrude beyond any solder balls attached to the package substrate by a distance sufficient to enable coupling of the pin(s) to a circuit board.

6. An apparatus according to claim 1, wherein the one or more strengthening pin(s) are coupled to each corner of the package substrate.

7. An apparatus according to claim 2, wherein the one or more strengthening pin(s) are coupled to a circuit board by securing the strengthening pin(s) into one or more blind via(s) on the circuit board using a solder reflow process.

8. An apparatus according to claim 2, wherein the one or more strengthening pin(s) are coupled to a circuit board by securing the strengthening pin(s) into one or more through-hole via(s) on the circuit board using a solder reflow process.

3. (canceled)

4. (canceled)

9. (canceled)

10. A method comprising:

receiving a package substrate;

preparing the package substrate; and

coupling one or more strengthening pin(s) to the periphery of the package substrate by providing a socket on an end of the one or more pin(s) and securing the socket to an edge of the package substrate.

11. A method according to claim 10, further comprising:

coupling the one or more strengthening pin(s) to a circuit board.

17. A method according to claim 10, wherein securing the socket to an edge of the package substrate occurs after a solder ball reflow process.

18. A method according to claim 10, wherein coupling one or more strengthening pin(s) to the periphery of the package substrate includes providing pin(s) to protrude beyond any solder balls coupled with the package substrate by a distance sufficient to enable insertion of the pin(s) into a circuit board.

19. A method according to claim 11, wherein coupling the one or more strengthening pin(s) to a circuit board comprises:

providing one or more via(s) on a circuit board;

placing solder paste over an opening of one or more via(s);

inserting one or more strengthening pin(s) through the solder paste into one or more via(s); and

reflowing the solder paste to form a solder joint between the one or more strengthening pin(s) and the circuit board.

20. A method according to claim 19, wherein providing one or more via(s) includes providing one or more blind via(s).

21. A method according to claim 19, wherein providing one or more via(s) includes providing one or more through-hole via(s).

12. (canceled)

13. (canceled)

14. (canceled)

15. (canceled)

16. (canceled)

22. A system comprising:

a circuit board;

a package substrate; and

one or more strengthening pin(s) coupled to the periphery of the package substrate wherein the one or more strengthening pin(s) are coupled to the substrate using a socket on an end of the pin(s) to secure the pin(s) to the substrate by affixing the socket to an edge of the substrate, the strengthening pin(s) also coupled to the circuit board.

25. A system according to claim 22, wherein the one or more strengthening pin(s) are coupled to the circuit board by securing the strengthening pin(s) into one or more blind via(s) on the circuit board using a solder reflow process.

26. A system according to claim 22, wherein the one or more strengthening pin(s) are coupled to the circuit board by securing the strengthening pin(s) into one or more through-hole via(s) on the circuit board using a solder reflow process.

27. A system according to claim 22, wherein the one or more strengthening pin(s) are coupled to each corner of the package substrate.

28. A system according to claim 22, wherein the one or more strengthening pin(s) protrude beyond any solder balls attached to the package substrate by a distance sufficient to enable insertion of the pin(s) into the circuit board.

23. (canceled)

24. (canceled)

29. A system comprising:

a package substrate;

one or more strengthening pin(s) coupled to the periphery of the package substrate wherein the one or more strengthening pin(s) are coupled to the substrate using a socket on an end of the pin(s) to secure the pin(s) to the substrate by affixing the socket to an edge of the substrate, the strengthening pin(s) also coupled to a circuit board; and

another device electrically coupled to the circuit board.