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Power lamp package

  • US 20060278882A1
  • Filed: 06/10/2005
  • Published: 12/14/2006
  • Est. Priority Date: 06/10/2005
  • Status: Active Grant
First Claim
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1. A semiconductor device die package comprising:

  • a substrate having a first surface for supporting a semiconductor device, and one or more substrate holes in said substrate at said first surface, and a reflector cup comprising at least one or more posts, each of which cooperates with a respective one of said substrate holes to anchor said reflector cup to said substrate.

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