H01L 2224/13084 :
Four-layer arrangements
H01L 2224/13099 :
Material
H01L 2224/13111 :
Tin [Sn] as principal const...
H01L 2224/13144 :
Gold [Au] as principal cons...
H01L 2224/13147 :
Copper [Cu] as principal co...
H01L 2224/13155 :
Nickel [Ni] as principal co...
H01L 2224/13166 :
Titanium [Ti] as principal ...
H01L 2224/13184 :
Tungsten [W] as principal c...
H01L 2224/1358 :
being stacked
H01L 2224/136 :
with a principal constituen...
H01L 2224/13609 :
Indium [In] as principal co...
H01L 2224/16146 :
the bump connector connecti...
H01L 2224/16237 :
the bump connector connecti...
H01L 2224/24226 :
the HDI interconnect connec...
H01L 2224/45111 :
Tin (Sn) as principal const...
H01L 2224/75 :
Apparatus for connecting wi...
H01L 2224/75305 :
comprising protrusions
H01L 2224/81001 :
involving a temporary auxil...
H01L 2224/81011 :
Chemical cleaning, e.g. etc...
H01L 2224/81054 :
Composition of the atmosphere
H01L 2224/81136 :
involving guiding structure...
H01L 2224/81193 :
wherein the bump connectors...
H01L 2224/81203 :
Thermocompression bonding, ...
H01L 2224/81204 :
with a graded temperature p...
H01L 2224/81825 :
Solid-liquid interdiffusion
H01L 2224/81894 :
Direct bonding, i.e. joinin...
H01L 2224/83102 :
using surface energy, e.g. ...
H01L 2224/92125 :
the second connecting proce...
H01L 2225/06513 :
Bump or bump-like direct el...
H01L 2225/06524 :
Electrical connections form...
H01L 2225/06531 :
Non-galvanic coupling, e.g....
H01L 2225/06534 :
Optical coupling
H01L 2225/06541 :
Conductive via connections ...
H01L 2225/06555 :
Geometry of the stack, e.g....
H01L 2225/06589 :
Thermal management, e.g. co...
H01L 2225/06593 :
Mounting aids permanently o...
H01L 2225/06596 :
Structural arrangements for...
H01L 23/427 :
Cooling by change of state,...
H01L 23/48 :
Arrangements for conducting...
H01L 23/481 :
Internal lead connections, ...
H01L 23/488 :
consisting of soldered or b...
H01L 23/49827 :
Via connections through the...
H01L 23/5389 :
the chips being integrally ...
H01L 23/552 :
Protection against radiatio...
H01L 23/66 :
High-frequency adaptations
H01L 24/02 :
Bonding areas on insulating...
H01L 24/11 :
Manufacturing methods for b...
H01L 24/13 :
of an individual bump conne...
H01L 24/16 :
of an individual bump conne...
H01L 24/24 :
of an individual high densi...
H01L 24/75 :
Apparatus for connecting wi...
H01L 24/81 :
using a bump connector
H01L 25/0652 :
the devices being arranged ...
H01L 25/0657 :
Stacked arrangements of dev...
H01L 25/18 :
the devices being of types ...
H01L 25/50 :
Multistep manufacturing pro...
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/00013 :
Fully indexed content
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01002 :
Helium [He]
H01L 2924/01004 :
Beryllium [Be]
H01L 2924/01005 :
Boron [B]
H01L 2924/01006 :
Carbon [C]
H01L 2924/01007 :
Nitrogen [N]
H01L 2924/01012 :
Magnesium [Mg]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01014 :
Silicon [Si]
H01L 2924/01018 :
Argon [Ar]
H01L 2924/01022 :
Titanium [Ti]
H01L 2924/01023 :
Vanadium [V]
H01L 2924/01024 :
Chromium [Cr]
H01L 2924/01025 :
Manganese [Mn]
H01L 2924/01027 :
Cobalt [Co]
H01L 2924/01028 :
Nickel [Ni]
H01L 2924/01029 :
Copper [Cu]
H01L 2924/0103 :
Zinc [Zn]
H01L 2924/01032 :
Germanium [Ge]
H01L 2924/01033 :
Arsenic [As]
H01L 2924/01042 :
Molybdenum [Mo]
H01L 2924/01046 :
Palladium [Pd]
H01L 2924/01047 :
Silver [Ag]
H01L 2924/01049 :
Indium [In]
H01L 2924/0105 :
Tin [Sn]
H01L 2924/01051 :
Antimony [Sb]
H01L 2924/01052 :
Tellurium [Te]
H01L 2924/01073 :
Tantalum [Ta]
H01L 2924/01074 :
Tungsten [W]
H01L 2924/01075 :
Rhenium [Re]
H01L 2924/01078 :
Platinum [Pt]
H01L 2924/01079 :
Gold [Au]
H01L 2924/01082 :
Lead [Pb]
H01L 2924/014 :
Solder alloys
H01L 2924/04953 :
TaN
H01L 2924/05042 :
Si3N4
H01L 2924/09701 :
Low temperature co-fired ce...
H01L 2924/10253 :
Silicon [Si]
H01L 2924/10329 :
Gallium arsenide [GaAs]
H01L 2924/14 :
Integrated circuits
H01L 2924/19041 :
being a capacitor
H01L 2924/19043 :
being a resistor
H01L 2924/30105 :
Capacitance
H01L 2924/3011 :
Impedance
H01L 2924/3025 :
Electromagnetic shielding
H01S 2301/176 :
Specific passivation layers...
H01S 5/02345 :
Wire-bonding
H01S 5/0237 :
by soldering
H01S 5/0422 :
with n- and p-contacts on t...
H01S 5/0425 :
Electrodes, e.g. characteri...
H01S 5/04254 :
characterised by the shape
H01S 5/04257 :
having positive and negativ...
H01S 5/183 :
having only vertical caviti...
H01S 5/18308 :
having a special structure ...