Mix of grafted and non-grafted particles in a resin

• US 20060281833A1
• Filed: 04/03/2006
• Published: 12/14/2006
• Est. Priority Date: 06/14/2005
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Power Generation, Inc.
• Inventors: Wood, John W., Stevens, Gary, Smith, James D. B.
• Granted Patent: US 7,655,295 B2
• Time in Patent Office: Days
• US Class Current: 523/200
• CPC Class Codes: C08G 59/4085 silicon containing compounds
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249955 Void-containing component partially impregnated with adjacent component
• CPC Class Codes: Y10T 428/249959 Void-containing component is wood or paper
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix 32 with a first class of grafted 31 high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted 30 high thermal conductivity particles that are not directly grafted the host resin matrix 32. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

Claims

1. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of grafted high thermal conductivity particles that are grafted to said host resin matrix; and

a second class of non-grafted high thermal conductivity particles that are not directly grafted said host resin matrix;

wherein said first class and said second class comprise approximately 2-60% by volume of said high thermal conductivity resin;

wherein said first class of grafted particles and said second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

2. The resin of claim 1, wherein said first class and said second class comprise approximately 25-40%.

3. The resin of claim 1, wherein said second class of non-grafted particles have been surface treated to not react with other particles with their class.

4. The resin of claim 1, wherein said second class of non-grafted particles have been surface treated to react with other particles with their class to form aggregations within the host resin matrix.

5. The resin of claim 1, wherein said first class of grafted particles have been surface treated to react with said second class of non-grafted particles.

6. The resin of claim 1, wherein said first class of grafted particles have an average length distribution at least ten times greater than said second class of non-grafted particles.

7. The resin of claim 1, wherein said host resin network includes epoxy, polyimide epoxy, liquid crystal epoxy, cyanate-ester, polybutadiene, and mixtures thereof.

8. The resin of claim 1, wherein high thermal conductivity resin is impregnated into a composite tape.

9. The resin of claim 8, wherein said second class of non-grafted particles are incorporated into said high thermal conductivity resin after said high thermal conductivity resin is impregnated into said composite tape.

10. The resin of claim 1, wherein non grafted becomes grafted to said host resin by the application of at least one of increased temperature and ultraviolet light.

11. The resin of claim 1, wherein the thermal conductivity particles are at least one of oxides, nitrides, and carbides.

12. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of grafted high thermal conductivity particles that are grafted to said host resin matrix; and

a second class of non-grafted high thermal conductivity particles that are not grafted to said host resin matrix;

wherein said first class and said second class comprise approximately 4-60% by volume of said high thermal conductivity resin;

wherein said first class of grafted particles and said second class of non-grafted particles are high thermal conductivity fillers are from 5-1000 nm in length, and have an aspect ratio of between 3-100;

wherein each of said classes of particles comprises at least 1% by volume of high thermal conductivity resin.

13. The resin of claim 12, wherein the resin is impregnated into a porous media.

14. The resin of claim 13, wherein the porous media is a paper matrix.

15. The resin of claim 13, wherein the ratios of said first class of grafted particles and said second class of non-grafted particles are different in different parts of said porous media due to a greater filtering effect that the porous media has on said second class of non-grafted particles.

16. The resin of claim 13, wherein the ratios of said first class of grafted particles and said second class of non-grafted particles are different in different parts of said porous media due to the original positioning of the particles.

17. The resin of claim 12, wherein said first class of grafted particles have a higher mechanical strength than said second class of non-grafted particles.

18. A high thermal conductivity resin comprising:

a host resin matrix;

a first class of grafted particles that are grafted to said host resin matrix, wherein said grafted particles increase the local strength of said host resin matrix; and

a second class of non-grafted high thermal conductivity particles that are not grafted to said host resin matrix;

wherein said first class and said second class comprise approximately 2-60% by volume of said high thermal conductivity resin;

wherein said class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

19. The resin of claim 18, wherein said second class of non-grafted particles have an average length of 2-10 times that of said first class of grafted particles.

20. The resin of claim 18, wherein at least a portion of said first class of grafted particles are high thermal conductivity fillers from 1-1000 nm in length, and have an aspect ratio of between 3-100.

21. The resin of claim 18, wherein a third class of non-grafted particles that are not high thermal conductivity particles are present in said host resin matrix.

22. The resin of claim 18, wherein said grafted particles increase the dielectric strength of said host resin matrix.