Cooling device and electronic apparatus

• US 20070002540A1
• Filed: 06/23/2006
• Published: 01/04/2007
• Est. Priority Date: 06/30/2005
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Granted Patent: US 7,486,518 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: G11B 20/00086 Circuits for prevention of unauthorised reproduction or copying, e.g. piracy indicating unauthorised use of record carriers in general G11B23/28; scrambling for television signal recording H04N5/913; network architectures or network protocols for network security H04L63/00; cryptographic mechanisms or cryptographic arrangements for secret or secure communication H04L9/00
• CPC Class Codes: G11B 20/00528 wherein each title is encrypted with a separate encryption key for each title, e.g. title key for movie, song or data file
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Claims

1. A cooling device comprising:

a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section;

a heat dissipation member thermally connected to the heat-sinking section; and

a fan that blows air to the heat dissipation member, wherein the heat transfer unit comprises;

a first plate member, in which a groove corresponding to the passage is formed; and

a second plate member, which covers the groove, the heat-receiving section and the heat-sinking section are provided on one of the first and second plate members, and

the fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

2. The cooling device according to claim 1, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

3. The cooling device according to claim 1, wherein the passage is formed circularly.

4. The cooling device according to claim 1, wherein a second groove corresponding to the passage is formed in the second plate member.

5. The cooling device according to claim 1, wherein the groove extends across the heat-receiving section.

6. The cooling device according to claim 1, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

7. The cooling device according to claim 1, wherein a plurality of protrusions, which are inclined toward a first direction, are formed all over a sidewall of the groove.

8. The cooling device according to claim 1, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

9. The cooling device according to claim 1, wherein a third plate member is connected to at least one of the first and second plate members at a portion avoiding the heating element, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.

10. The cooling device according to claim 1, wherein the fan has an air intake, and

the air intake opposes the heat transfer unit.

11. An electronic apparatus comprising:

a casing;

a heating element housed in the enclosure; and

a cooling device that cools the heating element, the cooling device comprising;

a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section;

a heat dissipation member thermally connected to the heat-sinking section; and

a fan that blows air to the heat dissipation member, wherein the heat transfer unit comprises;

a first plate member, in which a groove corresponding to the passage is formed; and

a second plate member, which covers the groove, the heat-receiving section and the heat-sinking section are provided on one of the first and second plate members, and

the fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

12. The electronic apparatus according to claim 11, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

13. The electronic apparatus according to claim 11, wherein the passage is formed circularly.

14. The electronic apparatus according to claim 11, wherein a second groove corresponding to the passage is formed in the second plate member.

15. The electronic apparatus according to claim 11, wherein the groove extends across the heat-receiving section.

16. The electronic apparatus according to claim 11, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

17. The electronic apparatus according to claim 11, wherein a plurality of protrusions, which are inclined toward a first direction, are formed all over a sidewall of the groove.

18. The electronic apparatus according to claim 11, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

19. The electronic apparatus according to claim 11, wherein a third plate member is connected to at least one of the first and second plate members at a portion avoiding the heating element, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members.

20. The electronic apparatus according to claim 11, wherein the fan has an air intake, and

the air intake opposes the heat transfer unit.