Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

• US 20070007033A1
• Filed: 10/06/2005
• Published: 01/11/2007
• Est. Priority Date: 07/11/2005
• Status: Active Grant

• Current Assignee: TTM Technologies North America, LLC (TTM Technologies Incorporated)
• Original Assignee: Endicott Interconnect Technologies Incorporated
• Inventors: Lauffer, John, Markovich, Voya, Magnuson, Roy, Das, Rabindra
• Granted Patent: US 7,442,879 B2
• Time in Patent Office: Days
• US Class Current: 174/257
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0245 Flakes, flat particles or lamellar particles
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2203/1152 Replicating the surface structure of a sacrificial layer, e.g. for roughening
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination

Abstract

A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.

Claims

1. A circuitized substrate comprising:

at least one organic dielectric layer having first and second opposing surfaces;

at least one opening within said at least one organic dielectric layer extending from said first opposing surface to said second opposing surface; and

a quantity of conductive paste positioned within said at least one opening, said quantity of conductive paste including a binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon.

2. The circuitized substrate of claim 1 in which said at least one organic dielectric layer is of a material selected from the group of materials consisting of fiberglass-reinforced epoxy resin, polytetrafluoroethylene, polyimide, polyamide, cyanate resin, photo-imageable material and combinations thereof,

3. The circuitized substrate of claim 1 wherein said metallic component is selected from the group consisting of copper, silver, gold, zinc, cadmium, palladium, iridium, ruthenium, osmium, rhodium, platinum, iron, cobalt, nickel, indium, tin, antimony, lead, bismuth and alloys thereof.

4. The circuitized substrate of claim 1 wherein said quantity of solder is selected from the group consisting of tin-lead, bismuth-tin, bismuth-tin-iron, tin, tin-silver, tin-gold, tin-silver-zinc, tin-silver-zinc-copper, tin-bismuth-silver, tin-copper, tin-copper-silver, tin-indium-silver, tin-antimony, tin-zinc, tin-zinc-indium, copper-based solders, and alloys thereof.

5. The circuitized substrate of claim 1 wherein said at least one opening is a thru-hole.

6. The circuitized substrate of claim 1 wherein said conductive paste is a low temperature conductive paste and said at least one dielectric layer is a high temperature dielectric.

7. The circuitized substrate of claim 1 further including at least one electrical component electrically coupled to said conductive paste, said circuitized substrate and said at least one electrical component forming an electrical assembly.

8. The invention of claim 7 further including a housing, said electrical assembly being positioned within said housing, said housing and said electrical assembly forming an information handling system.

9. A circuitized substrate comprising:

first and second organic dielectric layers each having a first surface thereon, said first surface of said first organic dielectric layer facing said first surface of said second organic dielectric layer;

at least one electrical conductor positioned on each of said first surfaces of said first and second organic dielectric layers; and

a quantity of conductive paste interconnecting said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon.

10. The circuitized substrate of claim 9 in which said at least one organic dielectric layer is of a material selected from the group of materials consisting of fiberglass-reinforced epoxy resin, polytetrafluoroethylene, polyimide, polyamide, cyanate resin, photo-imageable material and combinations thereof,

11. The circuitized substrate of claim 9 wherein said metallic component is selected from the group consisting of copper, silver, gold, zinc, cadmium, palladium, iridium, ruthenium, osmium, rhodium, platinum, iron, cobalt, nickel, indium, tin, antimony, lead, bismuth and alloys thereof.

12. The circuitized substrate of claim 9 wherein said quantity of solder is selected from the group consisting of tin-lead, bismuth-tin, bismuth-tin-iron, tin, tin-silver, tin-gold, tin-silver-zinc, tin-silver-zinc-copper, tin-bismuth-silver, tin-copper, tin-copper-silver, tin-indium-silver, tin-antimony, tin-zinc, tin-zinc-indium, copper-based solders, and alloys thereof.

13. The circuitized substrate of claim 9 wherein said at least one opening is a thru-hole.

14. The circuitized substrate of claim 9 wherein said conductive paste is a low temperature conductive paste and said at least one dielectric layer is a high temperature dielectric.

15. The circuitized substrate of claim 9 further including at least one electrical component electrically coupled to said conductive paste, said circuitized substrate and said at least one electrical component forming an electrical assembly.

16. The invention of claim 15 further including a housing, said electrical assembly being positioned within said housing, said housing and said electrical assembly forming an information handling system.

17. A method of making a circuitized substrate, said method comprising:

providing at least one organic dielectric layer having first and second opposing surfaces;

forming at least one opening within said at least one organic dielectric layer extending from said first opposing surface to said second opposing surface; and

positioning a quantity of conductive paste within said at least one opening, said quantity of conductive paste including a binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon.

18. The method of claim 17 wherein said forming of said at least one opening within said at least one organic dielectric layer is accomplished using laser or mechanical drilling.

19. The method of claim 17 wherein said positioning of said conductive paste within said at least one opening is accomplished using printing or needle dispensing.

20. A method of making a circuitized substrate, said method comprising:

providing first and second organic dielectric layers each having a first surface thereon;

forming at least one electrical conductor on each of said first surfaces of said first and second organic dielectric layers;

orienting said first and second dielectric layers such that said first surface of said first organic dielectric layer having at least one of said electrical conductors thereon faces said first surface of said second organic dielectric layer having at least one of said electrical conductors thereon; and

positioning a quantity of conductive paste between said first and second organic dielectric layers to interconnect said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon.

21. The method of claim 20 wherein said forming of said at least one electrical conductor on each of said first surfaces of said first and second organic dielectric layers is accomplished using photolithography processing.

22. The method of claim 20 wherein said positioning of said conductive paste within said at least one opening is accomplished using printing or needle dispensing.

23. A circuitized substrate comprising:

at least one organic dielectric layer having first and second opposing surfaces;

at least one opening within said at least one organic dielectric layer extending from said first opposing surface to said second opposing surface; and

a quantity of conductive paste positioned within said at least one opening, said quantity of conductive paste including a binder component and a plurality of nano-wires, selected ones of said nano-wires including a quantity of solder thereon.

24. The circuitized substrate of claim 23 wherein said at least one organic dielectric layer is of a material selected from the group of materials consisting of fiberglass-reinforced epoxy resin, polytetrafluoroethylene, polyimide, polyamide, cyanate resin, photo-imageable material and combinations thereof,

25. The circuitized substrate of claim 23 wherein said nano-wires are nano-tubes.

26. The circuitized substrate of claim 23 wherein said quantity of solder is selected from the group consisting of tin-lead, bismuth-tin, bismuth-tin-iron, tin, tin-silver, tin-gold, tin-silver-zinc, tin-silver-zinc-copper, tin-bismuth-silver, tin-copper, tin-copper-silver, tin-indium-silver, tin-antimony, tin-zinc, tin-zinc-indium, copper-based solders, and alloys thereof.

27. The circuitized substrate of claim 23 wherein said at least one opening is a thru-hole.

28. The circuitized substrate of claim 23 wherein said conductive paste is a low temperature conductive paste and said at least one dielectric layer is a high temperature dielectric.

29. The circuitized substrate of claim 23 further including at least one electrical component electrically coupled to said conductive paste, said circuitized substrate and said at least one electrical component forming an electrical assembly.

30. The invention of claim 29 further including a housing, said electrical assembly being positioned within said housing, said housing and said electrical assembly forming an information handling system.

31. A circuitized substrate comprising:

first and second organic dielectric layers each having a first surface thereon, said first surface of said first organic dielectric layer facing said first surface of said second organic dielectric layer;

at least one electrical conductor positioned on each of said first surfaces of said first and second organic dielectric layers; and

a quantity of conductive paste interconnecting said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a binder component and a plurality of nano-wires, selected ones of said nano-wires including a quantity of solder thereon.

32. The circuitized substrate of claim 31 wherein said at least one organic dielectric layer is of a material selected from the group of materials consisting of fiberglass-reinforced epoxy resin, polytetrafluoroethylene, polyimide, polyamide, cyanate resin, photo-imageable material and combinations thereof,

33. The circuitized substrate of claim 31 wherein said quantity of solder is selected from the group consisting of tin-lead, bismuth-tin, bismuth-tin-iron, tin, tin-silver, tin-gold, tin-silver-zinc, tin-silver-zinc-copper, tin-bismuth-silver, tin-copper, tin-copper-silver, tin-indium-silver, tin-antimony, tin-zinc, tin-zinc-indium, copper-based solders, and alloys thereof.

34. The circuitized substrate of claim 31 wherein said at least one opening is a thru-hole.

35. The circuitized substrate of claim 31 wherein said conductive paste is a low temperature conductive paste and said at least one dielectric layer is a high temperature dielectric.

36. The circuitized substrate of claim 31 further including at least one electrical component electrically coupled to said conductive paste, said circuitized substrate and said at least one electrical component forming an electrical assembly.

37. The invention of claim 36 further including a housing, said electrical assembly being positioned within said housing, said housing and said electrical assembly forming an information handling system.