Substrate handler, lithographic apparatus and device manufacturing method

• US 20070008512A1
• Filed: 07/06/2005
• Published: 01/11/2007
• Est. Priority Date: 07/06/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Jacobs, Hernes, Luttikhuis, Bernardus, Vosters, Petrus, Van Der Schoot, Harmen, Van Beuzekom, Aart, Hazenberg, Johannes
• Granted Patent: US 7,576,835 B2
• Time in Patent Office: Days
• US Class Current: 355/72
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Abstract

Embodiments of the invention relates to a substrate handler for handling a substrate, including a conditioning device for conditioning the substrate. In an embodiment, the substrate handler includes a displacing device configured to displace the substrate in a direction substantially parallel to the support surface, wherein the displacing device is configured to displace the substrate during the conditioning process from one conditioning position to one or more other conditioning positions. According to another embodiment of the invention, the substrate handler includes a float device for providing an air bed above a support surface of the substrate handler, the substrate handler being configured to support the substrate on an air bed during conditioning of the substrate.

Claims

1. A substrate handler for handling a substrate, comprising:

a conditioning device for conditioning said substrate on a support surface; and

a displacing device configured to displace said substrate in a direction substantially parallel to said support surface, wherein said displacing device is configured to displace said substrate during the conditioning process from one conditioning position to one or more other conditioning positions.

2. A substrate handler as claimed in claim 1, wherein said displacing device is configured to constantly move said substrate during said conditioning process.

3. A substrate handler as claimed in claim 1, wherein said displacing device is a gripping device configured to grip said substrate for moving said substrate in a direction substantially parallel to said support surface.

4. A substrate handler as claimed in claim 1, wherein said substrate handler comprises a float device configured to provide an air bed above a support surface of said substrate handler, said substrate handler being configured to keep said substrate floating on said air bed during conditioning of said substrate.

5. A substrate handler as claimed in claim 4, wherein said float device is configured to keep during conditioning said substrate floating on a float height of about 0.01-0.15 mm above said support surface.

6. A substrate handler as claimed in claim 5, wherein said float height is in a range of about 0.025-0.075 mm above said support surface.

7. A substrate handler as claimed in claim 4, wherein said float device is configured to, when displacing said substrate, keep said substrate floating on a float height of at least about 0.15 mm.

8. A substrate handler as claimed in claim 7, wherein said float height is at least about 0.20 mm.

11. A lithographic apparatus comprising:

an illumination system configured to condition a radiation beam;

an array of individually controllable elements configured to modulate a cross-section of the radiation beam;

a substrate table constructed to support a substrate; and

a projection system configured to project the modulated radiation beam onto a target portion of the substrate supported on said substrate table,

wherein said lithographic apparatus comprises a substrate handler as claimed in claim 1, which substrate handler is further configured to load a substrate on said substrate table.

9. A substrate handler for handling a substrate, comprising a conditioning device for conditioning said substrate and a float device for providing an air bed above a support surface of said substrate handler, said substrate handler being configured to keep said substrate floating on said air bed during conditioning of said substrate.

10. A substrate handler as claimed in claim 9, wherein said substrate handler comprises a displacing device configured to displace said substrate in a direction substantially parallel to said support surface, wherein said displacing device is configured to displace said substrate during the conditioning process from one conditioning position to one or more other conditioning positions.

12. A lithographic apparatus comprising:

an illumination system configured to condition a radiation beam;

an array of individually controllable elements configured to modulate a cross-section of the radiation beam;

a substrate table constructed to support a substrate; and

a projection system configured to project the modulated radiation beam onto a target portion of the substrate supported on said substrate table,

wherein said lithographic apparatus comprises a substrate handler as claimed in claim 9, which substrate handler is further configured to load a substrate on said substrate table.

13. A method for manufacturing a device comprising conditioning a substrate being supported on a support surface of a substrate handler, and, during said conditioning, displacing said substrate from one conditioning position to one or more other conditioning positions.

14. A method as claimed in claim 13, wherein during said conditioning said substrate is constantly moved.

15. A method as claimed in claim 13, wherein a direction of displacement from said one conditioning position to said one or more other conditioning positions is at least partially perpendicular to a direction of movement to load a substrate from the substrate handler on a substrate table next to the substrate handler.

16. A method as claimed in claim 13, further comprising floating said substrate on an air bed above said support surface during conditioning of said substrate.

17. A method as claimed in claim 16, wherein during conditioning said substrate floats on a float height of about 0.01-0.15 mm above said support surface.

18. A method as claimed in claim 17, wherein said float height is in a range of about 0.025-0.075 mm above said support surface.

19. A method as claimed in claim 16, wherein during displacement said substrate is on a float height of at least about 0.10 mm.

20. A method as claimed in claim 19, wherein said float height is at least about 0.15 mm.

21. A method as claimed in claim 20, wherein said float height is at least about 0.20 mm.

25. A flat panel display manufactured according to the method of claim 13.

22. A method for manufacturing a device comprising:

conditioning a substrate being supported on a support surface of a substrate handler; and

floating said substrate on an air bed above said support surface during conditioning of said substrate.

23. A method as claimed in claim 22, wherein the substrate floats during a complete handling by said substrate handler so that said substrate does not come into contact with said support surface.

24. A method as claimed in claim 22, further comprising, during said conditioning, displacing said substrate from one conditioning position to one or more other conditioning positions.

26. A flat panel display manufactured according to the method of claim 22.