MEMS package using flexible substrates, and method thereof

• US 20070013036A1
• Filed: 07/15/2005
• Published: 01/18/2007
• Est. Priority Date: 07/15/2005
• Status: Active Grant

• Current Assignee: Shandong Gettop Acoustic Company Limited (Weifang Gaoke Electronic Company Limited)
• Original Assignee: Silicon Matrix Pte., Ltd.
• Inventors: Zhe, Wang, Yubo, Miao
• Granted Patent: US 7,202,552 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.

Claims

1. A MEMS package comprising:

at least one MEMS device located on a flexible substrate; and

a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package.

2. The package according to claim 1 wherein said metal structure comprises copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

3. The package according to claim 1 wherein said flexible substrate comprises a core film with copper layers and solder resistive layers on both sides of said core film wherein said core film comprises polyimide, polyethylene polyimide, poly tetra fluoro ethylene, or liquid crystal polymer, and wherein said solder resistive layers comprise coverlay or photosensitive epoxy.

4. The package according to claim 1 wherein said metal structure comprises a metal ring surrounding said at least one MEMS device wherein said metal ring may comprise a copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

5. The package according to claim 4 wherein said flexible substrate further comprises a metal layer thereover and wherein said metal layer above and below said at least one MEMS device and said metal ring together provide EMI shielding of said at least one MEMS device.

6. The package according to claim 4 wherein said metal ring is attached to said flexible substrate by a conductive adhesive or a soldering material comprising eutectic PbSn or any lead-free SnAg or SnAgCu, or by a combination of a conductive adhesive or solder with a non-conductive adhesive.

7. The package according to claim 1 wherein said metal structure comprises a metal cap encapsulating said at least one MEMS device wherein said metal cap may comprise a copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

8. The package according to claim 7 wherein said flexible substrate further comprises a metal layer thereover and wherein said metal layer below said at least one MEMS device and said metal cap together provide EMI shielding of said at least one MEMS device.

9. The package according to claim 7 wherein said metal cap is attached to one portion of said flexible substrate at said bottom surface of said metal cap by a conductive adhesive, or soldering, or a combination of conductive adhesive or soldering and a non-conductive adhesive, or by a combination of a conductive adhesive or solder with a non-conductive adhesive.

10. The package according to claim 7 wherein said metal cap is attached to said flexible substrate at said top surface of said metal cap by an adhesive.

11. The package according to claim 1 further comprising one or more electronic components located on said flexible substrate and within said metal structure.

12. The package according to claim 11 further comprising wire bonding connections between said one or more electronic components and said at least one MEMS device.

13. The package according to claim 1 wherein said flexible substrate comprises an opening hole permitting interaction between said MEMS device and the environment outside said package wherein said opening hole also serves as a via connection for said metal layers on said flexible substrate.

14. The package according to claim 13 further comprising surface mount pads on an outer surface of said flexible substrate wherein said surface mount pads are located on an opposite side of said flexible substrate from said opening.

15. The package according to claim 1 wherein said flexible substrate further comprises a rigid layer laminated to a flexible layer wherein the folding portion is flexible and the other portions are rigid.

16. The package according to claim 15 wherein said rigid layer comprises a FR-4 layer.

17. The package according to claim 1 wherein said flexible substrate may be folded from at least one side to be attached to said metal structure.

18. A method for fabricating a MEMS package comprising:

mounting at least one MEMS device onto a flexible substrate;

attaching a bottom surface of a metal structure to said flexible substrate surrounding said at least one MEMS device; and

folding said flexible substrate over a top surface of said metal structure and attaching said flexible substrate to said top surface of said metal structure thereby forming said MEMS package.

19. The method according to claim 18 wherein said metal structure comprises a metal ring surrounding said at least one MEMS device and wherein said metal ring comprises copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

20. The method according to claim 19 wherein said flexible substrate comprises a core film and metal layers and wherein said metal layers above and below said at least one MEMS device and said metal ring together provide EMI shielding of said at least one MEMS device.

21. The method according to claim 18 wherein said metal structure comprises a metal cap encapsulating said at least one MEMS device wherein said metal cap comprises copper, a copper alloy, an aluminum alloy, an iron alloy with solderable metal finish, a plastic with a metal finish formed by either electroless plating or painting, or a conductive composite material formed by either injection molding or transfer molding.

22. The method according to claim 21 wherein said flexible substrate comprises a core film and a metal layer and wherein said metal layer below said at least one MEMS device and said metal cap together provide EMI shielding of said at least one MEMS device.

23. The method according to claim 18 wherein said flexible substrate comprises a top metal layer on a top surface of a flexible material and a bottom metal layer on a bottom surface of said flexible material.

24. The method according to claim 23 wherein said flexible material comprises polyimide, polyethylene polyimide, liquid crystal polymer, or poly tetra fluoro ethylene.

25. The method according to claim 23 wherein said top and bottom metal layers comprise copper plated with nickel and gold.

26. The method according to claim 23 further comprising forming a solder resist layer on surfaces of each of said top and bottom metal layers and patterning said solder resist layer, and said solder resist material comprises coverlay or photosensitive epoxy.

27. The method according to claim 18 further comprising mounting one or more electronic components on said flexible substrate and within said metal structure.

28. The method according to claim 18 after said folding said flexible substrate, further comprising:

providing surface mount pads on an outer surface of said flexible substrate opposite from said at least one MEMS device; and

attaching an application printed circuit board to said package at said surface mount pads.

29. The method according to claim 18 further comprising laminating a rigid layer to a flexible layer of said flexible substrate wherein the folding portion is flexible and the other portions are rigid.

30. The method according to claim 29 wherein said rigid layer comprises a FR-4 material.

31. The method according to claim 18 wherein said folding of said flexible substrate is made from at least one side to the top side of said metal structure.