Method for manufacturing bottom substrate of liquid crystal display device
First Claim
1. A method for manufacturing a bottom substrate of a liquid crystal display device, comprising following steps:
- (a) providing a substrate having a transparent electrode layer and a metal layer;
wherein the transparent electrode layer is located between the substrate and the metal layer;
(b) forming a patterned photoresist on the metal layer, wherein the patterned photoresist has a first thickness and a second thickness;
(c) etching the patterned photoresist, the transparent electrode layer, and the metal layer over the substrate to define a signal line, a thin film diode area, a pixel area, and a conductive electrode-line;
wherein the thin film diode area has the transparent electrode layer, the metal layer, and a gap; and
(d) forming an oxidized layer on partial surface of the metal layer;
wherein the gap of the thin film diode is filled with the oxidized layer.
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Abstract
A method for manufacturing liquid crystal display substrates comprises the steps of: (a) providing a substrate having a transparent electrode layer and a metal layer; (b) forming a patterned photoresist layer through half-tone or diffraction; (c) defining signal line area and thin film diode area, or pixel area and conductive electrode-lines by etching; and (d) forming an oxidized layer on partial surface of the metal layer. The disclosure here provides a patterning process of lithography and etching with one photolithography of one single mask in the manufacturing of liquid crystal display substrates. Furthermore, the method disclosed here can effectively increase the yield of manufacturing, and reduce the cost of manufacturing.
8 Citations
10 Claims
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1. A method for manufacturing a bottom substrate of a liquid crystal display device, comprising following steps:
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(a) providing a substrate having a transparent electrode layer and a metal layer;
wherein the transparent electrode layer is located between the substrate and the metal layer;
(b) forming a patterned photoresist on the metal layer, wherein the patterned photoresist has a first thickness and a second thickness;
(c) etching the patterned photoresist, the transparent electrode layer, and the metal layer over the substrate to define a signal line, a thin film diode area, a pixel area, and a conductive electrode-line;
wherein the thin film diode area has the transparent electrode layer, the metal layer, and a gap; and
(d) forming an oxidized layer on partial surface of the metal layer;
wherein the gap of the thin film diode is filled with the oxidized layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification