Vapor chamber and manufacturing method thereof

• US 20070022603A1
• Filed: 06/08/2006
• Published: 02/01/2007
• Est. Priority Date: 07/29/2005
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Chen, Chin-Ming, Cheng, Chin-Ming, Lin, Chi-Feng, Chuang, Ming-Te
• Application Number:
  US11/448,822
• Publication Number:
  US 20070022603A1
• Time in Patent Office: Days
• US Class Current: 29/890.32
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: B23P 2700/09 Heat pipes
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A vapor chamber applied to an electronic device generating heat is provided. The vapor chamber includes a hollow tube and a capillary structure, which is continuously formed on the inner surface of the hollow tube. The method for manufacturing the vapor chamber includes providing a hollow tube, forming the capillary structure on the inner surface of the hollow tube, filling a working fluid into the tube, and finally evacuating the hollow tube and sealing the other end of the tube, so as to provide better thermal transferring effect.

Claims

1. A method for manufacturing a vapor chamber, comprising:

providing a hollow tube and forming a capillary structure on an inner surface thereof;

sealing an end of the hollow tube and filling a working fluid thereinto; and

evacuating the hollow tube and sealing the other end of the hollow tube.

2. The method as claimed in claim 1, wherein the hollow tube is made of aluminum, copper, titanium, molybdenum, or a metal with a high thermal conductivity.

3. The method as claimed in claim 1, wherein the hollow tube is integrally formed by copper extrusion or drawing.

4. The method as claimed in claim 1, wherein the hollow tube is circular, elliptical, half-circular, rectangular, triangular, square, trapezoid, pentagonal, hexagonal, octagonal, equilateral or inequilateral in cross-section.

5. The method as claimed in claim 1, wherein the hollow tube comprises a partition separating the hollow tube into a plurality of closed rooms.

6. The method as claimed in claim 5, wherein the capillary structure is formed on a surface of the partition.

7. The method as claimed in claim 1, wherein the capillary structure is formed by sintering.

8. The method as claimed in claim 1, wherein the capillary structure comprises a metal spring, groove, pillar, mesh or metal powder porous structure.

9. The method as claimed in claim 1, wherein the hollow tube is sealed by welding, soldering, fusing or other mechanical process.

10. The method as claimed in claim 1, wherein the working fluid comprises inorganic compounds, water, alkane, alcohol, liquid metal, ketone, Freon or organic compounds.

11. A vapor chamber, comprising:

a hollow tube comprising a capillary structure continuously formed on an inner surface of the hollow tube, wherein both ends of the hollow tube are sealed and a working fluid is filled in the hollow tube.

12. The vapor chamber as claimed in claim 11, wherein the hollow tube is made of aluminum, copper, titanium, molybdenum, or a metal with a high thermal conductivity.

13. The vapor chamber as claimed in claim 11, wherein the hollow tube is integrally formed by copper extrusion or drawing.

14. The vapor chamber as claimed in claim 11, wherein the hollow tube is circular, elliptical, half-circular, rectangular, triangular, square, trapezoid, pentagonal, hexagonal, octagonal, equilateral or inequilateral in cross-section.

15. The vapor chamber as claimed in claim 11, wherein the hollow tube comprises a partition separating the hollow tube into a plurality of closed rooms.

16. The vapor chamber as claimed in claim 15, wherein the capillary structure is further formed on a surface of the partition.

17. The vapor chamber as claimed in claim 11, wherein the capillary structure is formed by sintering.

18. The vapor chamber as claimed in claim 11, wherein the capillary structure comprises a metal spring, groove, pillar, mesh or metal powder porous structure.

19. The vapor chamber as claimed in claim 11, wherein the hollow tube is sealed by welding, soldering, fusing or other mechanical process.

20. The vapor chamber as claimed in claim 11, wherein the working fluid comprises inorganic compounds, water, alkane, alcohol, liquid metal, ketone, Freon or organic compounds.