Controllable target cooling
First Claim
1. A sputtering target, comprising:
- a backing plate including a plurality of laterally extending parallel cylindrical cooling holes formed therein; and
one or more sputtering target tiles bonded to one of two principal surfaces of the backing plate.
1 Assignment
0 Petitions
Accused Products
Abstract
A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
58 Citations
23 Claims
-
1. A sputtering target, comprising:
-
a backing plate including a plurality of laterally extending parallel cylindrical cooling holes formed therein; and
one or more sputtering target tiles bonded to one of two principal surfaces of the backing plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A target backing plate, comprising:
-
an integral metal plate; and
a plurality of parallel cooling holes extending through the plate parallel to a principal surface of the metal plate having a target area which is configured to be bonded to one or more target tiles. - View Dependent Claims (18, 19, 20)
-
- 21. A method of sputtering in a sputter reactor having a target assembly with parallel cooling channels formed laterally therethrough and sealed on one side to a processing chamber containing a substrate to be sputter coated and on a second side to a magnetron chamber containing a scanned magnetron, comprising flowing a liquid coolant in opposed directions in different ones of the cooling channels.
-
23. A sputtering method performed in a sputter reactor comprising a main chamber containing a substrate to be processed, a target backing plate to which is bonded one or more target tiles and which is sealed to the main chamber, and a vacuum-pumped magnetron chamber sealed to the backing plate, said method comprising the flowing coolant in counter-flowing directions through respective pluralities of cylindrical cooling holes formed in and extending across the backing plate in parallel to a principal surface of the backing plate.
Specification