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METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER

  • US 20070026631A1
  • Filed: 07/31/2006
  • Published: 02/01/2007
  • Est. Priority Date: 07/29/2005
  • Status: Active Grant
First Claim
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1. A circuitry component comprising:

  • a semiconductor substrate;

    a pad over said semiconductor substrate;

    a tantalum-containing layer on a side wall and a bottom surface of said pad;

    a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad;

    a titanium-containing layer over said pad exposed by said opening; and

    a gold layer over said titanium-containing layer.

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