METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
First Claim
Patent Images
1. A circuitry component comprising:
- a semiconductor substrate;
a pad over said semiconductor substrate;
a tantalum-containing layer on a side wall and a bottom surface of said pad;
a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad;
a titanium-containing layer over said pad exposed by said opening; and
a gold layer over said titanium-containing layer.
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Abstract
A circuitry component comprising a semiconductor substrate, a pad over said semiconductor substrate, a tantalum-containing layer on a side wall and a bottom surface of said pad, a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad, a titanium-containing layer over said pad exposed by said opening, and a gold layer over said titanium-containing layer.
76 Citations
20 Claims
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1. A circuitry component comprising:
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a semiconductor substrate;
a pad over said semiconductor substrate;
a tantalum-containing layer on a side wall and a bottom surface of said pad;
a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad;
a titanium-containing layer over said pad exposed by said opening; and
a gold layer over said titanium-containing layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A circuitry component comprising:
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a semiconductor substrate;
a pad over said semiconductor substrate;
a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad, wherein said passivation layer comprises a first silicon-nitride layer, a silicon-oxide layer over said first silicon nitride layer, and a second silicon-nitride layer over said silicon-oxide layer;
a titanium-containing layer over said pad exposed by said opening; and
a gold layer over said titanium-containing layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A circuitry component comprising:
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a semiconductor substrate;
an insulating layer over said semiconductor substrate, wherein said insulating layer has a dielectric constant of lower than 3;
a copper pad over said insulating layer;
a passivation layer over said insulating layer, an opening in said passivation layer exposing said copper pad;
a titanium-containing layer over said copper pad exposed by said opening; and
a gold layer over said titanium-containing layer.
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Specification