Integration of touch sensors with directly mounted electronic components

• US 20070030254A1
• Filed: 03/17/2006
• Published: 02/08/2007
• Est. Priority Date: 07/21/2005
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Jambor, George, Maag, Jonathan, Robrecht, Michael
• Application Number:
  US11/377,976
• Publication Number:
  US 20070030254A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/0354 with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0416 Control or interface arrangements specially adapted for digitisers
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/046 by electromagnetic means

Abstract

Disclosed is a touch sensor assembly that includes a touch sensor overlay and one or more circuit boards held in place by a frame. The touch sensor overlay includes a plurality of touch sensitive elements and a plurality of conductors connected to the touch sensitive elements arranged on the touch sensor periphery. The one or more circuit boards are electrically connected to the plurality of conductors on the touch sensor periphery. The circuit boards include circuitry for conditioning signals communicated by the touch sensitive elements due to a touch on the touch sensor overlay. Also disclosed are methods of bonding circuit boards to a touch sensor overlay.

Claims

1. A touch sensor assembly comprising:

a touch sensor overlay comprising a plurality of touch sensitive elements and a plurality of conductors connected to the touch sensitive elements arranged on the touch sensor periphery; and

a frame subassembly affixed to the touch sensor periphery, the frame subassembly comprising a frame and one or more circuit boards held in place by the frame, the one or more circuit boards electrically connected to the plurality of conductors,

wherein the circuit boards include circuitry for conditioning signals communicated by the touch sensitive elements due to a touch on the touch sensor overlay.

2. The touch sensor assembly of claim 1, wherein the touch sensor overlay comprises one or more flexible films laminated to a rigid substrate, the plurality of touch sensitive elements and the plurality of conductors being formed on the flexible film.

3. The touch sensor assembly of claim 2, wherein the frame has a coefficient of thermal expansion that falls within a range bounded by the coefficients of thermal expansion of the one or more flexible films and the rigid substrate.

4. The touch sensor assembly of claim 1, wherein the frame comprises a glass filled liquid crystal polymer or a glass filled polycarbonate.

5. The touch sensor assembly of claim 1, wherein frame subassembly is affixed to the touch sensor by a pressure sensitive adhesive, the pressure sensitive adhesive having apertures in each of which is placed a conductive material to electrically connect the one or more circuit boards to the plurality of conductors.

6. The touch sensor assembly of claim 1, wherein frame subassembly is affixed to the touch sensor by a z-axis conductive adhesive that functions to electrically connect the one or more circuit boards to the plurality of conductors.

7. The touch sensor assembly of claim 1, wherein the frame subassembly further comprises self-fixturing features.

8. The touch sensor assembly of claim 7, wherein the self-fixturing features include alignment tabs extending from the plane of the frame.

9. The touch sensor assembly of claim 7, wherein the self-fixturing features determine a spacing between one or more of the frame and a part of the touch sensor, the frame and the one or more circuit boards, and the one or more circuit boards and a part of the touch sensor.

10. A method of bonding electronics to a touch sensitive overlay comprising the steps of:

providing a touch sensor comprising a plurality of touch sensitive elements and a plurality of conductors connected to the touch sensitive elements arranged on the touch sensor periphery;

providing one or more circuit boards that include circuitry for conditioning signals communicated by the touch sensitive elements due to a touch on the touch sensor, each circuit board having a plurality of conductive contact areas;

dispensing an insulative adhesive on the touch sensor periphery and forming apertures in the adhesive to individually expose the plurality of conductors on the touch sensor;

placing a conductive material on the plurality of conductors; and

positioning the one or more circuit boards on the touch sensor periphery so that the conductive material electrically connects each of the conductive contact areas to one of the plurality of conductors, and the adhesive bonds the circuit board to the touch sensor.

11. The method of claim 10, further comprising using a frame to aid in the positioning of the one or more circuit boards.

12. The method of claim 11, further comprising providing self-fixturing features on the frame to control a spacing of one or more of:

a. the one or more circuit boards and a part of the touch sensor;

b. the frame and part of the touch sensor; and

c. the frame and the one or more circuit boards.

13. The method of claim 11, wherein the frame has a coefficient of thermal expansion that closely matches the coefficient of thermal expansion of the touch sensor materials.

14. The method of claim 10, wherein the step of dispensing and forming apertures in the adhesive is performed prior to placing the conductive material on the plurality of conductors.

15. The method of claim 10, wherein the step of placing the conductive material on the plurality of conductors is performed prior to dispensing and forming apertures in the adhesive.

16. The method of claim 10, wherein the step of dispensing and forming apertures in the adhesive comprises forming the apertures in a pressure sensitive adhesive layer and adhering the pressure sensitive adhesive layer to the touch sensor periphery.