HEAT SINK

• US 20070053164A1
• Filed: 09/06/2005
• Published: 03/08/2007
• Est. Priority Date: 09/06/2005
• Status: Active Grant

• Current Assignee: Lear Corporation GmbH (Lear Corporation)
• Original Assignee: Lear Corporation
• Inventors: Goemmel, Frank, Hammer, Roland
• Granted Patent: US 7,336,491 B2
• Time in Patent Office: Days
• US Class Current: 361/714
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: Y10S 439/949 Junction box with busbar for plug-socket type interconnection with receptacle

Abstract

A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.

Claims

1. A heat dissipation device for electrical components comprising:

an outer surface configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device; and

an inner surface that defines a cavity within the heat dissipation device.

2. A device according to claim 1, wherein the electrical components are mounted to the outer surface of the heat dissipation device through the use of a gap pad or a paste that is disposed between the electrical component and the outer surface.

3. A device according to claim 1, further comprising a cover having an upper cover portion and the cover being attachable to the heat dissipation device.

4. A device according to claim 3, wherein the cover includes a protrusion configured to provide a contact surface for surface mount devices.

5. A device according to claim 4, further comprising a circuit board being disposed between the protrusion and the surface mount devices.

6. A device according to claim 3, wherein the cover has a side cover portion that includes a protrusion configured to contact the electrical component.

7. A device according to claim 1, wherein the inner surface is substantially void of extrusions.

8. A device according to claim 1, wherein the outer surface being configured for mounting the electrical components thereon is further configured to define a side cavity in which leaded devices are mounted.

9. A device according to claim 1, wherein the inner surface is substantially void of fastening devices.

10. A device according to claim 1, wherein the inner surface that defines a cavity includes a cavity having a lower cavity surface and an upper cavity surface.

11. A device according to claim 10, wherein the upper cavity surface is configured to provide a surface in which surface mount devices are mounted.

12. A device according to claim 10, wherein the inner surface that defines a cavity, includes a cavity having multiple upper cavity surfaces.

13. A method of dissipating heat from electrical components through the use of a heat dissipation device, the method comprising:

configuring the heat dissipation device to have an outer surface and an inner surface, wherein the inner surface defines a cavity within the heat dissipation device; and

mounting the electrical components on the outer surface of the heat dissipation device to allow the transfer of heat from the electrical components to the heat dissipation device.

14. A method according to claim 13, further including configuring the heat dissipation device to include a cover that is attachable thereto that has an upper cover portion and a side cover portion.

15. A method according to claim 14, wherein configuring the heat dissipation device to include a cover having an upper cover portion and a side cover portion includes an upper cover portion and a side cover portion having at least one protrusion for contacting electrical components.

16. A method according to claim 13, wherein the inner surface which defines a cavity within the heat dissipation device is a substantially void of extrusions.

17. A method according to claim 13, wherein the inner surface is substantially void of fastening devices.

18. A method according to claim 13, wherein configuring the heat dissipation device to have the inner surface that defines a cavity includes a cavity having a lower cavity surface and an upper cavity surface, wherein the upper cavity surface is adapted for mounting surface mount devices thereon.

19. A method according to claim 18, wherein configuring the heat dissipation device to have the inner surface having a lower cavity surface and an upper cavity surface further includes a inner surface having multiple upper cavity surfaces for mounting surface mount devices thereon.

20. A method according to claim 13, wherein mounting the electrical components on the outer surface of the heat dissipation device includes mounting the electrical components within a side cavity defined by the outer surface, wherein the electrical components include leaded devices.