LED LIGHTING WITH INTEGRATED HEAT SINK AND PROCESS FOR MANUFACTURING SAME
First Claim
1. A method for manufacturing an LED lamp assembly, comprising the steps of:
- anodizing at least a portion of a surface of an electrically and thermally conductive base so as to form an electrically insulating coating;
forming circuit traces on the anodized surface of the base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing; and
electrically and mechanically attaching an LED to the LED landing by means of conductive metallic solder, whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and to the base.
8 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by means of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway.
60 Citations
22 Claims
-
1. A method for manufacturing an LED lamp assembly, comprising the steps of:
-
anodizing at least a portion of a surface of an electrically and thermally conductive base so as to form an electrically insulating coating;
forming circuit traces on the anodized surface of the base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing; and
electrically and mechanically attaching an LED to the LED landing by means of conductive metallic solder, whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and to the base. - View Dependent Claims (2, 3, 4, 5, 6, 8, 9, 10, 11)
-
-
7. The method of 6, including the step of disposing a heat conductive material between the base and the heat sink.
-
12. A method for manufacturing an LED lamp assembly, comprising the steps of:
-
anodizing at least a portion of a surface of an electrically and thermally conductive aluminum or aluminum alloy base comprising a heat sink so as to form an electrically insulating aluminum oxide coating thereon;
forming circuit traces on the anodized surface of the heat sink base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing; and
electrically and mechanically attaching an LED to the circuit trace LED landing by means of conductive metallic solder, whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and to the heat sink base. - View Dependent Claims (13, 14, 15, 16, 17)
-
-
18. A method for manufacturing an LED lamp assembly, comprising the steps of:
-
anodizing at least a portion of a surface of an electrically and thermally conductive aluminum or aluminum alloy metal base so as to form an electrically insulating aluminum oxide coating;
forming circuit traces on the anodized surface of the metal base to establish discrete and electrically conductive paths for electrically interconnecting electronic components, the circuit traces including at least one LED landing;
electrically and mechanically attaching an LED to the circuit trace LED landing by means of conductive metallic solder;
coupling the metal base to a metal heat sink; and
disposing a heat conductive material between the metal base and the heat sink;
whereby heat generated from the LED is transferred through the solder and circuit trace LED landing and metal base to the heat sink. - View Dependent Claims (19, 20, 21, 22)
-
Specification