Electronic device and method of manufacturing thereof

• US 20070075034A1
• Filed: 10/11/2004
• Published: 04/05/2007
• Est. Priority Date: 10/15/2003
• Status: Active Grant

• Current Assignee: Vida Sense Innovation Ltd. (Advanced IP Innovations Limited)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Van Montfort, Vincent, Kusters, Roel, Verweg, Fransiscus Gerardus
• Granted Patent: US 7,433,202 B2
• Time in Patent Office: Days
• US Class Current: 216/16
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4253 by embedding housing components in an adhesive or a polymer material G02B6/4212 takes precedence
• CPC Class Codes: G02B 6/4255 Moulded or casted packages
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/187 the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/3452 : Solder masks

Abstract

The electronic device comprises a body (40) of electrically insulating material that is provided with a through-hole or cavity. In the cavity or through-hole an electric component (20) is present. This component is attached to the body through an attachment layer (13). The surface of this attachment layer is provided with a pattern of electrical conductors for electrically coupling the component to other components and/or contact means for external coupling. At least one of which electrical conductors extends to a surface of the body.

Claims

1. An electronic device comprising a body of electrically insulating material that is provided with a through-hole or cavity, in which an electric component is present, the component being attached to the body through an attachment layer, provided with a pattern of electrical conductors for electrically coupling the component to other components and/or contact means for external coupling, at least one of which electrical conductors extends into the body and is electrically coupled to a further conductor that is embedded in the body and is at least partially exposed to a surface of the body.

2. A device as claimed in claim 1, wherein the body further comprises embedded components, which are coupled electrically to the same pattern of electrical conductors.

3. A device as claimed in claim 1, wherein the component is chosen from the group of optically active and optically sensitive components.

4. A device as claimed in claim 3, wherein the electrically insulating material of the body is an optically transparent material, and there is a light path to the component through the body of transparent material.

5. A device as claimed in claim 1, wherein the pattern of conductors extends in a first and a second plane, said planes including an angle unequal to 180°

.

6. A device as claimed in claim 5, wherein the conductors at the first plane include contact means for electrical coupling to an external device and said component is coupled to conductors located at the second plane.

7. A device as claimed in claim 6, wherein the component is chosen from the group of optically active and optically sensitive components.

8. A device as claimed in claim 1, wherein the electrical conductors are mechanically anchored in the body and/or in the attachment layer.

9. A device as claimed in claim 1, further provided with an integrated shield.

10. A method of manufacturing an electronic device comprising a body of electrically insulating material provided with a pattern of electrical conductors, said method comprising the steps of:

providing a carrier with at a first side the pattern of electrical conductors and at an opposed second side a sacrificial layer;

providing an attachment layer at the first side;

mounting a first electric component at the first side of the carrier, therewith also providing electrical coupling from the component to contact pads in the pattern of conductors

providing the body of electrically insulating material in a moulding process at the first side of the carrier, such that the first component is kept outside the body, and

removing the sacrificial layer of the carrier at least partially.

11. A method as claimed in claim 10, characterized in that a second electric component is mounted at the first side of the carrier before the provision of the body, which second component is thereafter encapsulated in the body.