Optical imaging device for optical proximity communication

• US 20070075444A1
• Filed: 08/31/2006
• Published: 04/05/2007
• Est. Priority Date: 10/03/2005
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Zheng, Xuezhe, Cunningham, John, Krishnamoorthy, Ashok
• Granted Patent: US 7,574,077 B2
• Time in Patent Office: Days
• US Class Current: 257/797
• CPC Class Codes: G02B 6/12007 forming wavelength selective elements, e.g. multiplexer, demultiplexer
• CPC Class Codes: G02B 6/29341 Loop resonators operating in a whispering gallery mode evanescently coupled to a light guide, e.g. sphere or disk or cylinder evanescent coupling for sensing fluorescence G01N21/648
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/83194 Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/90 : Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/10157 : at the active surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

Claims

1. An assembly comprising:

an optical coupling device having a first portion and a second portion;

a first electronic device comprising;

a first substrate having a first pit formed therein; and

a first optical waveguide; and

a second electronic device comprising;

a second substrate having a second pit formed therein; and

a second optical waveguide;

wherein the first portion of the optical coupling device is disposed in the first pit;

wherein the second portion of the optical coupling device is disposed in the second pit;

wherein the first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device;

wherein the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide; and

wherein the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

2. The assembly as recited in claim 1, wherein the optical coupling device aligns the first electronic device with the second electronic device.

3. The assembly as recited in claim 1, wherein the first optical waveguide comprises a shape that causes the size of a mode of the first optical waveguide to increase in a region of the first optical waveguide that is nearest to the optical coupling device.

4. The assembly as recited in claim 3, wherein the second optical waveguide comprises a shape that causes the size of a mode of the second optical waveguide to increase in a region of the second optical waveguide that is nearest to the optical coupling device.

5. The assembly as recited in claim 1, wherein:

the optical signal is a first optical signal;

the first electronic device further comprises a third optical waveguide; and

the second electronic device further comprises a fourth optical waveguide;

the third optical waveguide is positioned relative to the optical coupling device to direct a second optical signal to the optical coupling device;

the fourth optical waveguide is positioned relative to the optical coupling device to receive the second optical signal, which is directed from the optical coupling device to the fourth optical waveguide; and

the optical coupling device optically couples the third optical waveguide to the fourth optical waveguide.

6. The assembly as recited in claim 1, wherein:

the optical signal is a first optical signal;

the second optical waveguide is positioned relative to the optical coupling device to direct a second optical signal to the optical coupling device; and

the first optical waveguide is positioned relative to the optical coupling device to receive the second optical signal, which is directed from the optical coupling device to the first optical waveguide.

7. The assembly as recited in claim 1, further comprising a region around the first pit to allow for propagation of the optical signal between the first optical waveguide and the optical coupling device.

8. The assembly as recited in claim 1, wherein the optical coupling device is a lens.

9. The assembly as recited in claim 1, wherein at least a portion of the surface of the optical coupling device comprises a substantially spherical shape.

10. The assembly as recited in claim 1, wherein the optical coupling device comprises at least one of:

glass, quartz, and sapphire.

11. The assembly as recited in claim 1, further comprising:

a first alignment device having a first portion and a second portion; and

a second alignment device having a first portion and a second portion;

wherein the first substrate comprises a third pit and a fourth pit;

wherein the second substrate comprises a fifth pit and a sixth pit;

wherein the first portion of the first alignment device is disposed in the third pit;

wherein the second portion of the first alignment device is disposed in the fifth pit;

wherein the first portion of the second alignment device is disposed in the fourth pit;

wherein the second portion of the second alignment device is disposed in the sixth pit; and

wherein the optical coupling device, the first alignment device, and the second alignment device align the first electronic device with the second electronic device.

12. The assembly as recited in claim 11, wherein the first alignment device is an optical coupling device.

13. The assembly as recited in claim 1, further comprising:

a first alignment device having a first portion and a second portion; and

a second alignment device having a first portion and a second portion;

a third electronic device having a third substrate comprising a third pit;

a fourth electronic device having a fourth substrate comprising a fourth pit;

wherein the substrate of the first electronic device further comprises a fifth pit and a sixth pit;

wherein the first portion of the first alignment device is disposed in the third pit;

wherein the second portion of the first alignment device is disposed in the fifth pit;

wherein the first portion of the second alignment device is disposed in the fourth pit;

wherein the second portion of the second alignment device is disposed in the sixth pit; and

wherein the optical coupling device, the first alignment device, and the second alignment device align the first electronic device relative to the second electronic device, the third electronic device, and the fourth electronic device.

14. A method of assembling a first electronic device and a second electronic device, wherein:

the first electronic device comprises;

a first substrate having a first pit formed therein; and

a first optical waveguide; and

a second electronic device comprising;

a second substrate having a second pit formed therein; and

a second optical waveguide;

and wherein the method comprises;

disposing a first portion of an optical coupling device in the first pit, wherein the first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device; and

disposing a second portion of the optical coupling device in the second pit, wherein the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide;

wherein the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

15. The method as recited in claim 14, further comprising etching the first pit in a shape to receive the optical coupling device.

16. The method as recited in claim 14, further comprising forming the first waveguide on or in the first substrate such that a tip of the first waveguide is a first pre-determined distance from a point of the optical coupling device.

17. The method as recited in claim 16, further comprising forming the second waveguide on or in the second substrate such that a tip of the second waveguide is a second pre-determined distance from a point of the optical coupling device.

18. The method as recited in claim 17, wherein the first pre-determined distance and the second pre-determined distance are selected such that an object signal at the tip of the first waveguide is directed by the optical coupling device to an image signal at the second waveguide.

19. An assembly comprising:

a first electronic device comprising;

a first substrate having a first pit formed therein;

a first optical waveguide defined on the first substrate;

a second electronic device comprising;

a second substrate having a second pit formed therein;

a second optical waveguide defined on the second substrate; and

an optical coupling device having a first portion and a second portion;

wherein the first portion of the optical coupling device is disposed in the first pit to optically couple the optical coupling device to the first optical waveguide;

wherein the second portion of the optical coupling device is disposed in the second pit to optically couple the optical coupling device to the second optical waveguide; and

wherein the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

20. An assembly comprising:

an optical coupling device;

a first electronic device comprising a first substrate and a first optical waveguide on the first substrate; and

a second electronic device comprising a second substrate and a second optical waveguide on the second substrate;

wherein the optical coupling device is positioned relative to the first optical waveguide such that an optical signal is directed to the optical coupling device from the first optical waveguide; and

wherein the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal from the optical coupling device.

21. The assembly as recited in claim 20, wherein the optical coupling device aligns the first electronic device with the second electronic device.

22. The assembly as recited in claim 20, wherein the first optical waveguide comprises a shape that causes the size of a mode of the first optical waveguide to increase in a region of the first optical waveguide that is nearest to the optical coupling device.

23. The assembly as recited in claim 22, wherein the second optical waveguide comprises a shape that causes the size of a mode of the second optical waveguide to increase in a region of the second optical waveguide that is nearest to the optical coupling device.

24. The assembly as recited in claim 20, wherein:

the optical signal is a first optical signal;

the optical coupling device is positioned relative to the second optical waveguide such that a second optical signal is directed to the optical coupling device from the second optical waveguide; and

the first optical waveguide is positioned relative to the optical coupling device to receive the second optical signal from the optical coupling device.

25. The assembly as recited in claim 20, wherein the optical coupling device is a lens.

26. The assembly as recited in claim 20, wherein at least a portion of the surface of the optical coupling device comprises a substantially spherical shape.

27. The assembly as recited in claim 20, wherein the optical coupling device comprises at least one of:

glass, quartz, and sapphire.

28. An assembly comprising:

a first electronic device comprising;

a first substrate;

a first optical waveguide defined on the first substrate;

a second electronic device comprising;

a second substrate;

a second optical waveguide defined on the second substrate; and

an optical coupling device having a first portion and a second portion;

wherein the first portion of the optical coupling device is disposed in the first substrate to optically couple the optical coupling device to the first optical waveguide;

wherein the second portion of the optical coupling device is disposed in the second substrate to optically couple the optical coupling device to the second optical waveguide; and

wherein the optical coupling device optically couples the first optical waveguide to the second optical waveguide.