Radiation emitting component

• US 20070080337A1
• Filed: 09/26/2006
• Published: 04/12/2007
• Est. Priority Date: 09/29/2005
• Status: Active Grant

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Sorg, Jorg
• Granted Patent: US 7,675,085 B2
• Time in Patent Office: Days
• US Class Current: 257/13
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting component (1) comprising a radiation source, a housing body (6), a radiation exit side (16), an underside (17) which is opposite the radiation exit side (16), a side surface (18) which connects the radiation exit side (16) and the underside (17), and at least one first contact region (2a, 3a). The first contact region (2a, 3a) extends along the side surface (18) and is in the form of a partial region of a carrier (23) that runs outside the housing body (6).

Claims

1. A radiation-emitting component comprising:

a radiation source;

a housing body;

a radiation exit side;

an underside which is opposite the radiation exit side;

a side surface which connects the radiation exit side and the underside; and

at least one first contact region extending along the side surface and being in the form of a partial region of a carrier that runs outside the housing body.

2. The radiation-emitting component as claimed in claim 1,

the component being mounted on the radiation exit side.

3. The radiation-emitting component as claimed in claim 1,

the component being mounted on the underside.

4. The radiation-emitting component as claimed in claim 1,

the component being mounted on the side surface.

5. The radiation-emitting component as claimed in claim 1,

the first contact region being thermally conductive.

6. The radiation-emitting component as claimed in claim 1,

the first contact region being in the form of a tab-shaped partial region of the carrier.

7. The radiation-emitting component as claimed in claim 1,

the first contact region being bent out from a plane that extends along the underside.

8. The radiation-emitting component as claimed in claim 1, further comprising:

at least one second contact region which extends along the underside.

9. The radiation-emitting component as claimed in claim 8,

the second contact region being electrically conductive.

10. The radiation-emitting component as claimed in claim 8,

the second contact region being in the form of a partial region of the carrier.

11. The radiation-emitting component as claimed in claim 1,

the carrier being in two parts.

12. The radiation-emitting component as claimed in claim 1,

the carrier being thermally and electrically conductive.

13. The radiation-emitting component as claimed in claim 1,

the carrier containing a metal and/or a metal compound.

14. The radiation-emitting component as claimed in claim 13,

the metal compound being a copper alloy.

15. The radiation-emitting component as claimed in claim 1,

the radiation source comprising at least one radiation-emitting semiconductor chip.

16. The radiation-emitting component as claimed in claim 15,

the radiation-emitting semiconductor chip being a thin-film semiconductor chip.

17. The radiation-emitting component as claimed in claim 15,

the carrier comprising a chip mounting region for the semiconductor chip.

18. The radiation-emitting component as claimed in claim 17,

the chip mounting region being connected to the first contact region in a thermally conductive manner.

19. The radiation-emitting component as claimed in claim 17,

the chip mounting region being a partial region of the second contact region.

20. The radiation-emitting component as claimed in claim 15,

the carrier comprising a chip connection region for the semiconductor chip.

21. The radiation-emitting component as claimed in claim 20,

the chip connection region being a partial region of the second contact region.

22. The radiation-emitting component as claimed in claim 1,

the radiation source being operated as a flashlight.

23. The radiation-emitting component as claimed in claim 1,

a conversion element being arranged downstream of the radiation source in the radiating direction, said conversion element at least partially converting radiation at a first wavelength, which is emitted by the radiation source, into radiation at a second wavelength that is different to the first wavelength.

24. The radiation-emitting component as claimed in claim 1,

an electrically insulating layer being arranged between the carrier and the housing body.

25. The radiation-emitting component as claimed in claim 24,

the electrically insulating layer containing a plastic material.

26. The radiation-emitting component as claimed in claim 1,

a beam-shaping element being arranged downstream of the radiation source.

27. The radiation-emitting component as claimed in claim 26,

the beam-shaping element being integrally formed with the housing body.

28. An electronic device having a radiation-emitting component as claimed in claim 1,

the first contact region being connected to a cooling body.

29. The electronic device as claimed in claim 28,

the second contact region being electrically connected.

30. The electronic device as claimed in claim 28,

the electronic device being a PDA, a digital camera or a mobile telephone, in particular having an integrated camera.

31. The electronic device as claimed in claim 30,

the radiation-emifting component being provided for flashlight operation.

32. The electronic device as claimed in claim 30,

the radiation-emifting component being provided for continuous operation, preferably as a film light.