LED Assembly with Vented Circuit Board

• US 20070081341A1
• Filed: 10/04/2006
• Published: 04/12/2007
• Est. Priority Date: 05/18/2004
• Status: Active Grant

• Current Assignee: Illumafinity, LLC (Ascend Innovation Management, LLC)
• Original Assignee: OnScreen Technologies, Inc.
• Inventors: Flank, Steven, Raos, Robert, Desai, Nilesh
• Granted Patent: US 7,315,049 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: G09F 13/20 with luminescent surfaces or parts luminescent compositions C09K11/00; light sources using luminescence F21K2/00
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2203/081 Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
• CPC Class Codes: H05K 2203/1178 Means for venting or for letting gases escape
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Claims

1. A circuit board LED display assembly, comprising:

a substrate comprising a first electrical layer and a second electrical layer electrically insulated from the first electrical layer, wherein the substrate is formed in a grid pattern having junctions at the intersection of bridges defining air vents through which air can freely pass through the substrate; and

a plurality of LEDs arranged at the junctions and electrically connected to the first electrical layer and the second electrical layer.

2. The circuit board LED display assembly according to claim 1, wherein the first electrical layer and the second electrical layer are separated by an insulating layer in a multi-layer substrate.

3. The circuit board LED display assembly according to claim 1, wherein each of the vents is many times larger than the size of each junction.

4. The circuit board LED display assembly according to claim 1, further comprising roughness members that promote air turbulence over the structure.

5. The circuit board LED display assembly of claim 1, wherein the substrate comprises a thermally conductive and electrically resistive layer to which the plurality of LEDs are attached, wherein the first electrically conductive layer is formed below the thermally conductive and electrically resistive layer.