Method and arrangement for correcting thermally-induced field deformations of a lithographically exposed substrate
First Claim
1. A method for correcting thermally-induced field deformations of a lithographically exposed substrate comprising:
- providing a model to predict thermally-induced field deformation information of a plurality of fields of said substrate;
modifying pre-specified exposure information used to configure an exposure of said fields based on said thermally-induced deformation information as predicted by said model;
exposing a pattern onto said fields in accordance with said pre-specified exposure information as modified;
wherein predicting thermally-induced field deformation information by said model includes predicting of deformation effects of selected points on said substrate based on at least;
a time-decaying characteristic as energy is transported across said substrate; and
a distance between said selected points and an edge of said substrate.
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Abstract
The invention provides a method for correcting thermally-induced field deformations of a lithographically exposed substrate. First, a model is provided to predict thermally-induced field deformation information of a plurality of fields of the substrate. The pre-specified exposure information used to configure an exposure of the fields is then modified based on the thermally-induced deformation information as predicted by the model. Finally a pattern is exposed onto the fields in accordance with the pre-specified exposure information as modified. The predicting of thermally-induced field deformation information by the model includes predicting of deformation effects of selected points on the substrate. It is based on a time-decaying characteristic as energy is transported across substrate; and a distance between the selected points and an edge of the substrate.
18 Citations
25 Claims
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1. A method for correcting thermally-induced field deformations of a lithographically exposed substrate comprising:
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providing a model to predict thermally-induced field deformation information of a plurality of fields of said substrate;
modifying pre-specified exposure information used to configure an exposure of said fields based on said thermally-induced deformation information as predicted by said model;
exposing a pattern onto said fields in accordance with said pre-specified exposure information as modified;
wherein predicting thermally-induced field deformation information by said model includes predicting of deformation effects of selected points on said substrate based on at least;
a time-decaying characteristic as energy is transported across said substrate; and
a distance between said selected points and an edge of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A device for correcting thermally-induced field deformations of a lithographically exposed substrate comprising:
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a measurement station configured to measure attributes of a plurality of fields provided on said substrate; and
a processor unit, said processor unit comprising a model to predict thermally-induced field deformation information of said plurality of fields of said substrate;
wherein said measurement station is arranged to;
obtain measurement data on the substrate which is provided to said measurement station, said substrate comprising a pattern exposed with pre-specified exposure information;
provide said measurement data to said processor unit;
and wherein said processor unit is arranged to;
receive pre-specified exposure information;
determine said model by comparing said received pre-specified exposure information and said measurement data, received from said measurement station;
predict thermally-induced field deformation information by employing said model;
modify said pre-specified exposure information;
wherein predicting thermally-induced field deformation information by said model includes predicting of deformation effects of selected points based on at least;
a time-decaying characteristic as energy is transported across said substrate; and
a distance between said selected points and an edge of said substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification