Solid state direct heat to cooling converter

• US 20070084497A1
• Filed: 10/19/2005
• Published: 04/19/2007
• Est. Priority Date: 10/19/2005
• Status: Abandoned Application

• Current Assignee: Richard Strnad
• Original Assignee: Richard Strnad
• Inventors: Strnad, Richard
• Application Number:
  US11/253,975
• Publication Number:
  US 20070084497A1
• Time in Patent Office: Days
• US Class Current: 136/203
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

A combination of Peltier and Seebeck effect provides effective way to convert thermal energy to cooling. The common electrodes are electrically in contact with both devices cells, the cell generating electricity and the cell converting electricity to cooling. Additional factors providing for superior performance are the diced Peltier elements, and possibility of utilizing different material thermoelectric elements to generate electricity. Relatively low operating temperature of Bismuth Telluride may be increased by selecting materials such as CuAgSe, Si—Ge, BiSbTe and other. These materials may operate at temperatures of 1,000° C. or higher. That may prove advantageous in automobile application where the temperature of exhaust pipe gases is high.

Claims

1. ) A heat to cooling converter, comprising:

a first type of thermoelectric element coupled to an adiabatic plane;

said adiabatic plane absorbing heat from said first type of thermoelectric element;

a second type of thermoelectric element coupled to said adiabatic plane;

wherein said first type of thermoelectric element includes a port for accepting a cooling substance.

2. ) A heat to cooling converter as in claim 1, wherein said first type of the thermoelectric element includes a Seebeck element.

3. ) A heat to cooling converter as in claim 1 wherein said second type of thermoelectric element includes a Peltier device.

4. ) A heat to cooling converter as in claim 1, wherein said port includes a tube to accept a cooling substance.

5. ) A heat to cooling converter as in claim 4, wherein said tube includes electrical conductive material.

6. ) A heat to cooling converter as in claim 4 wherein said tube is positioned approximately in said adiabatic plane.

13. ) The heat to cooling converter as in claim 2, wherein the Seebeck device includes a pellet for higher output voltage.

15. ) The heat to cooling converter as in claim 3, wherein the Peltier device includes a power converting element have smaller contact area for improved conversion.

7. ) A heat to cooling converter, comprising:

a first type of thermoelectric element coupled to an adiabatic plane;

said adiabatic plane absorbing heat from said first type of thermoelectric element;

a second type of thermoelectric element coupled to said adiabatic plane;

wherein said first type of thermoelectric element includes a slot for accepting a cooling substance.

8. ) A heat to cooling converter as in claim 7, wherein said first type of the thermoelectric element includes a Seebeck element.

9. ) A heat to cooling converter as in claim 7 wherein said second type of thermoelectric element includes a Peltier device.

10. ) A heat to cooling converter, comprising:

a first type of thermoelectric element coupled to an adiabatic plane;

said adiabatic plane absorbing heat from said first type of thermoelectric element;

a second type of thermoelectric element coupled to said adiabatic plane;

wherein said first type of thermoelectric element includes a portion having a different length to area (1/a) ratio then a portion of said second type of thermoelectric element.

11. ) A heat to cooling converter as in claim 10 wherein said first type of the thermoelectric element includes a Seebeck element.

12. ) A heat to cooling converter as in claim 10 wherein said second type of thermoelectric element includes a Peltier device.

14. ) The heat to cooling converter as in claim 11, wherein said pellet is diced into smaller pellets to provide higher power transfer for improved performance.