Semiconductor device having first and second separation trenches
First Claim
1. A semiconductor device comprising:
- a SOI substrate having a SOI layer, a buried oxide layer and a support substrate, which are stacked in this order;
a plurality of first separation trenches disposed on the SOI layer and reaching the buried oxide layer;
a plurality of MOS transistors, each of which is surrounded with one of the first separation trenches so that the MOS transistor is isolated;
a second separation trench disposed on the SOI layer and reaching the buried oxide layer, wherein the second separation trench includes a plurality of field trenches, which are defined as first to n-th field trenches so that the second separation trench provides n-ply field trenches, and wherein n represents a predetermined natural number; and
a plurality of field regions surrounded with the second separation trench, wherein the field regions are defined as first to n-th field regions so that a k-th field region is surrounded with a k-th field trench, and wherein k is a natural number in a range between 1 and n, wherein one of the MOS transistors surrounded with one of the first separation trenches is disposed in each field region so that a k-th MOS transistor is disposed in the k-th field region, the MOS transistors are electrically connected in series between a ground potential and a predetermined power source potential, the first field region is disposed on an utmost outside and on a ground potential side, and the n-th field region is disposed on an utmost inside and on a power source potential side, the first MOS transistor in the first field region has a gate terminal, which provides an input terminal, the n-th MOS transistor in the n-th field region is electrically connected to the power source potential through an output resistor so that an output signal is retrieved from a connection between the n-th MOS transistor and the output resistor, and the n-th field region has an electric potential, which is fixed to the power source potential.
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Accused Products
Abstract
A semiconductor device includes: a SOI substrate having a SOI layer, a buried oxide layer and a support substrate; multiple first separation trenches on the SOI layer; multiple MOS transistors, each of which is surrounded with one first separation trench; a second separation trench on the SOI layer including n-ply field trenches; and multiple field regions such that a k-th field region is surrounded with a k-th field trench. One MOS transistor is disposed in each field region. The MOS transistors are connected in series. The first MOS transistor has a gate terminal as an input terminal. The n-th MOS transistor is connected to the power source potential through an output resistor. The n-th field region has an electric potential, which is fixed to the power source potential.
18 Citations
31 Claims
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1. A semiconductor device comprising:
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a SOI substrate having a SOI layer, a buried oxide layer and a support substrate, which are stacked in this order;
a plurality of first separation trenches disposed on the SOI layer and reaching the buried oxide layer;
a plurality of MOS transistors, each of which is surrounded with one of the first separation trenches so that the MOS transistor is isolated;
a second separation trench disposed on the SOI layer and reaching the buried oxide layer, wherein the second separation trench includes a plurality of field trenches, which are defined as first to n-th field trenches so that the second separation trench provides n-ply field trenches, and wherein n represents a predetermined natural number; and
a plurality of field regions surrounded with the second separation trench, wherein the field regions are defined as first to n-th field regions so that a k-th field region is surrounded with a k-th field trench, and wherein k is a natural number in a range between 1 and n, wherein one of the MOS transistors surrounded with one of the first separation trenches is disposed in each field region so that a k-th MOS transistor is disposed in the k-th field region, the MOS transistors are electrically connected in series between a ground potential and a predetermined power source potential, the first field region is disposed on an utmost outside and on a ground potential side, and the n-th field region is disposed on an utmost inside and on a power source potential side, the first MOS transistor in the first field region has a gate terminal, which provides an input terminal, the n-th MOS transistor in the n-th field region is electrically connected to the power source potential through an output resistor so that an output signal is retrieved from a connection between the n-th MOS transistor and the output resistor, and the n-th field region has an electric potential, which is fixed to the power source potential. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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a SOI substrate having a SOI layer, a buried oxide layer and a support substrate, which are stacked in this order;
a plurality of first separation trenches disposed on the SOI layer and reaching the buried oxide layer;
a plurality of MOS transistors, each of which is surrounded with one of the first separation trenches so that the MOS transistor is isolated;
a second separation trench disposed on the SOI layer and reaching the buried oxide layer, wherein the second separation trench includes a plurality of field trenches, which are defined as first to n-th field trenches so that the second separation trench provides n-ply field trenches, and wherein n represents a predetermined natural number;
a plurality of field regions surrounded with the second separation trench, wherein the field regions are defined as first to n-th field regions so that a k-th field region is surrounded with a k-th field trench, and wherein k is a natural number in a range between 1 and n; and
a hollow disposed in a part of the support substrate, the part which faces all field regions through the buried oxide layer, wherein one of the MOS transistors surrounded with one of the first separation trenches is disposed in each field region so that a k-th MOS transistor is disposed in the k-th field region, the MOS transistors are electrically connected in series between a ground potential and a predetermined power source potential, the first field region is disposed on an utmost outside and on a ground potential side, and the n-th field region is disposed on an utmost inside and on a power source potential side, the first MOS transistor in the first field region has a gate terminal, which provides an input terminal, the n-th MOS transistor in the n-th field region is electrically connected to the power source potential through an output resistor so that an output signal is retrieved from a connection between the n-th MOS transistor and the output resistor, and the hollow reaches the buried oxide layer. - View Dependent Claims (19, 20)
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21. A semiconductor device comprising:
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a SOI substrate having a SOI layer and an insulation substrate, which are stacked in this order;
a plurality of first separation trenches disposed on the SOI layer and reaching the insulation substrate;
a plurality of MOS transistors, each of which is surrounded with one of the first separation trenches so that the MOS transistor is isolated;
a second separation trench disposed on the SOI layer and reaching the insulation substrate, wherein the second separation trench includes a plurality of field trenches, which are defined as first to n-th field trenches so that the second separation trench provides n-ply field trenches, and wherein n represents a predetermined natural number; and
a plurality of field regions surrounded with the second separation trench, wherein the field regions are defined as first to n-th field regions so that a k-th field region is surrounded with a k-th field trench, and wherein k is a natural number in a range between 1 and n, wherein one of the MOS transistors surrounded with one of the first separation trenches is disposed in each field region so that a k-th MOS transistor is disposed in the k-th field region, the MOS transistors are electrically connected in series between a ground potential and a predetermined power source potential, the first field region is disposed on an utmost outside and on a ground potential side, and the n-th field region is disposed on an utmost inside and on a power source potential side, the first MOS transistor in the first field region has a gate terminal, which provides an input terminal, and the n-th MOS transistor in the n-th field region is electrically connected to the power source potential through an output resistor so that an output signal is retrieved from a connection between the n-th MOS transistor and the output resistor. - View Dependent Claims (22, 23, 24)
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25. A semiconductor device comprising:
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a SOI substrate having a SOI layer, a buried oxide layer and a support substrate, which are stacked in this order;
a plurality of first separation trenches disposed on the SOI layer and reaching the buried oxide layer;
a plurality of MOS transistors, each of which is surrounded with one of the first separation trenches so that the MOS transistor is isolated;
a second separation trench disposed on the SOI layer and reaching the buried oxide layer, wherein the second separation trench includes a plurality of field trenches, which are defined as first to n-th field trenches so that the second separation trench provides n-ply field trenches, and wherein n represents a predetermined natural number; and
a plurality of field regions surrounded with the second separation trench, wherein the field regions are defined as first to n-th field regions so that a k-th field region is surrounded with a k-th field trench, and wherein k is a natural number in a range between 1 and n, wherein one of the MOS transistors surrounded with one of the first separation trenches is disposed in each field region so that a k-th MOS transistor is disposed in the k-th field region, the MOS transistors are electrically connected in series between a ground potential and a predetermined power source potential, the first field region is disposed on an utmost outside and on a ground potential side, and the n-th field region is disposed on an utmost inside and on a power source potential side, the first MOS transistor in the first field region has a gate terminal, which provides an input terminal, the n-th MOS transistor in the n-th field region is electrically connected to the power source potential through an output resistor so that an output signal is retrieved from a connection between the n-th MOS transistor and the output resistor, and the buried oxide layer has a relative dielectric constant smaller than 3.9. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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Specification