Assembled device of a light module and a liquid crystal panel

• US 20070103930A1
• Filed: 11/09/2005
• Published: 05/10/2007
• Est. Priority Date: 11/09/2005
• Status: Abandoned Application

• Current Assignee: .Ultra-Bright Leds Co., Ltd.
• Original Assignee: .Ultra-Bright Leds Co., Ltd.
• Inventors: Cheng, Tzu-Chi, Lee, Kun-Chui
• Application Number:
  US11/269,656
• Publication Number:
  US 20070103930A1
• Time in Patent Office: Days
• US Class Current: 362/561
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133609 including means for improving the color mixing, e.g. white
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An assembled device of a light module and a liquid crystal panel is composed of a liquid crystal panel whose bottom surface is provided with a light module which includes a circuit board on which are welded at least more than one blue light chip, which is next to a red light chip, as a blue light emitting source, and more than one red light chip as a red light emitting source. A light emitting illumination layer, which is made by uniformly mixing an illumination powder with a transparent glue, is located above the blue light chip and the red light chip, so as to develop into a white light as a back light source whose rendering effect and uniformity are of a good quality and can be easily controlled.

Claims

1. An assembled device of a light module and a liquid crystal panel comprising a liquid crystal panel whose bottom surface is provided with a light module which includes a circuit board on which are welded at least more than one blue light chip, which is next to a red light chip, as a blue light emitting source, and more than one red light chip as a red light emitting source;

a light emitting illumination layer made by uniformly mixing an illumination powder with a transparent glue, and located on the blue light chips and the red light chips.

2. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein a light diffusion plate is located between the light module and the liquid crystal panel, the illumination layer can be uniformly coated on a surface of the light diffusion plate whose lower surface is provided with an adhesive layer for attaching to a frame at a periphery of the circuit board.

3. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein the blue light chip and the red light chip are installed in a slot of a same light reflection cap whose pins of two electrodes are welded on the circuit board and the transparent glue is filled in the slot.

4. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein the blue light chip and the red light chip are independently installed in slots of two separate light reflection caps whose pins of two electrodes are separately welded on the circuit board and whose pitch is controlled to be within 1 mm, and the transparent glue is filled in the slots of two light reflection caps and on the surface of circuit board.

5. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein one or two or three combinations from the following mixtures can be chosen as a material of illumination powder in the illumination layer:

the aluminum garnet series activated by plutonium and containing Y and Al (YAG;

Ce³⁺), the garnet series activated by europium (YAG;

EU^2+/3+), and the garnet series activated by terbium (YAG;

Tb³⁺).

6. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein a transparent light enhancing membrane used for enhancing light is added between the liquid crystal panel and the light diffusion plate.

7. The assembled device of a light module and a liquid crystal panel according to claim 1, wherein the plural and neighboring blue light chips and red light chips are welded on the circuit board in multiple rows of one-dimensional array.