×

Inductive Heating of Microelectronic Components

  • US 20070119051A1
  • Filed: 01/30/2007
  • Published: 05/31/2007
  • Est. Priority Date: 12/21/2001
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for heat treating a plurality of resilient conductive interconnect structures, the method comprising:

  • providing a contactor comprising a substrate to which the plurality of resilient conductive interconnect structures are attached;

    placing the contactor in an oscillating electromagnetic field, the oscillating electromagnetic field heating the resilient conductive interconnect structures without substantially heating the substrate; and

    maintaining the contactor in the oscillating electromagnetic field until a substantially entire portion of each of the resilient conductive interconnect structures substantially obtains a defined heat-treatment temperature substantially greater than an ambient temperature for a predetermined period of time sufficient to permanently change a mechanical operating property of the resilient conductive interconnect structures

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×