HALL IC TYPE CURRENT SENSOR OF VEHICLE-MOUNTED POWER CONVERTER

• US 20070120552A1
• Filed: 01/16/2007
• Published: 05/31/2007
• Est. Priority Date: 01/29/2004
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: KANEDA, Naohito
• Granted Patent: US 7,323,860 B2
• Time in Patent Office: Days
• US Class Current: 324/117.R
• CPC Class Codes: G01R 15/202 using Hall-effect devices Hall elements in arrangements for measuring electrical power G01R21/08
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10363 Jumpers, i.e. non-printed cross-over connections
• CPC Class Codes: H05K 2201/105 Mechanically attached to another device attached components H05K2201/10537

Abstract

In a Hall IC type current sensor of a vehicle-mounted power converter which includes a bus bar which supplies electricity to a vehicle-mounted power converter, a Hall IC which detects a current supplied to the bus bar, and a control board on which a control circuit which controls the vehicle-mounted power converter in response to an output of the Hall IC is mounted, the current sensor further includes a Hall IC holder which holds the Hall IC and is also fixed to the bus bar, and a through hole which is formed in the control board and which allows a lead terminal of the Hall IC to pass therethrough, and the lead terminal which passes through the through hole is connected with the control circuit by solder bonding.

Claims

1. A Hall IC type current sensor of a vehicle-mounted power converter comprising:

a bus bar which is connected with a power source and supplies electricity to a vehicle-mounted power converter;

a Hall IC which measures a magnetic flux which is generated when electricity is supplied to the bus bar, outputs an electric signal in response to the density of the magnetic flux and detects a current supplied to the bus bar; and

a control board on which a control circuit which controls the vehicle-mounted power converter in response to an output of the Hall IC is mounted, wherein

the current sensor further includes

a Hall IC holder which holds the Hall IC on which a lead frame is formed by insert molding and which allows a lead terminal to be connected to the lead frame, and is also fixed to the bus bar or the control board; and

a through hole which is formed in the control board and which allows an extension portion of the lead frame to pass therethrough, and

the extension portion of the lead frame which passes through the through hole is connected with the control circuit by solder bonding.

2. A Hall IC type current sensor of a vehicle-mounted power converter according to claim 1, wherein the Hall IC is formed on the Hall IC holder by insert molding.

3. The Hall IC type current sensor according to claim 1, wherein the terminal do not reach the through hole and are electrically bonded to the lead frame.

4. The Hall IC type current sensor according to claim 1, wherein the holder only holds the Hall IC.

5. A Hall IC type current sensor of a vehicle-mounted power converter comprising:

a bus bar connected with a power source and configured to supply electricity to a vehicle-mounted power converter;

a Hall IC measuring a magnetic flux which is generated when electricity is supplied to the bus bar, outputting an electric signal in response to the density of the magnetic flux and detecting a current supplied to the bus bar;

a control board on which a control circuit controlling the vehicle-mounted power converter in response to an output of the Hall IC, is mounted; and

a Hall IC holder holding only the Hall IC and fixed to the bus bar;

wherein the Hall IC holder holds the Hall IC on which a lead frame is formed by insert molding and which allows a lead terminal to be connected to the lead frame, and wherein a through hole is formed in the control board, which allows an extension portion of the lead frame to pass therethrough, and wherein the extension portion of the lead frame which passes through the through hole is connected with the control circuit by solder bonding.