Film-forming method and film-forming equipment

• US 20070123007A1
• Filed: 11/28/2006
• Published: 05/31/2007
• Est. Priority Date: 11/30/2005
• Status: Abandoned Application

• Current Assignee: NuFlare Technology, Inc. (Toshiba Corporation)
• Original Assignee: NuFlare Technology, Inc. (Toshiba Corporation)
• Inventors: Mitani, Shinichi, Furutani, Hiroshi, Nishibayashi, Michio, Nakazawa, Seiichi
• Application Number:
  US11/604,841
• Publication Number:
  US 20070123007A1
• Time in Patent Office: Days
• US Class Current: 438/478
• CPC Class Codes: C23C 16/4401 Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• CPC Class Codes: C23C 16/45589 Movable means, e.g. fans
• CPC Class Codes: C30B 25/14 Feed and outlet means for the gases; Modifying the flow of the reactive gases
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02546 Arsenides
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD

Abstract

A plurality of wafers are loaded on a susceptor installed in a reaction chamber, and the wafers are heated, and process gas is fed from a plurality of stages of openings formed in a gas feed nozzle installed so as to pass through the center of the susceptor, the process gas is fed obliquely downward from the uppermost openings, and the process gas feeding directions are changed to the reaction chamber relatively. The thickness of deposits on the wall of the reaction chamber is suppressed, the maintenance cycle of film forming equipment is extended, and the throughput can be improved.

Claims

1. A film forming method comprising:

loading a plurality of wafers on a susceptor installed in a reaction chamber,

heating the wafers,

feeding process gas from a plurality of stages of openings formed in a gas feed nozzle installed so as to pass through a center of the susceptor,

feeding the process gas obliquely downward from an uppermost openings among the plurality of stages of openings formed, and

changing process gas feeding directions from the plurality of stages of the openings to the reaction chamber relatively.

2. The film forming method according to claim 1, wherein from each of the plurality of stages of the openings, the process gas is fed in three or more directions with a substantially equal phase difference.

3. The film forming method according to claim 1, wherein among the plurality of stages of the openings, at least the uppermost openings and lowermost openings have a same phase.

4. The film forming method according to claim 2, wherein the gas feed nozzle is rotated to change the process gas feeding directions from the openings to the reaction chamber relatively.

5. The film forming method according to claim 4, wherein the gas feed nozzle is rotated at a predetermined angle while the reaction chamber is opened to the air.

6. The film forming method according to claim 5, wherein the predetermined angle is different from the phase difference of the directions of feeding the process gas.

7. The film forming method according to claim 2, wherein the gas feed nozzle is rotated during the process gas being fed.

8. The film forming method according to claim 1, wherein from the uppermost openings, the process gas is fed in a direction at an angle of smaller than 90°

with a rotary shaft of the gas feed nozzle.

9. The film forming method according to claim 1, wherein, the process gas is fed in a direction satisfying the following formula when an angle of the directions of feeding the process gas from the uppermost openings with a central axis of the gas feed nozzle as γ

and an angle of a line connecting an edge of the susceptor and a center of a base of projections of the uppermost openings with the central axis of the gas feed nozzle as β

;

β

≦

γ

≦

0.3β

+63 (degrees)

10. The film forming method according to claim 1, wherein the gas feed nozzle moves up and down.

11. Film forming equipment comprising:

a reaction chamber for forming a film on a wafer,

a susceptor for loading a plurality of the wafers,

a heater installed right under or inside the susceptor for heating the wafers,

a gas feed nozzle, installed so as to pass through a central part of the susceptor, having a plurality of stages of openings for feeding process gas onto the wafers, and

a rotating mechanism for changing the openings relatively to the reaction chamber, wherein;

uppermost stage of the openings have projections for feeding the process gas obliquely downward.

12. The film forming equipment according to claim 11, wherein each stage of the openings are installed at three or more locations at a substantially equal angle in the peripheral direction.

13. The film forming equipment according to claim 11, wherein the uppermost stage of the openings and lowermost stage of the openings have a same phase.

14. The film forming equipment according to claim 11, wherein in the plurality of stages of openings, an interval of at least one stage is different from intervals of the other stages.

15. The film forming equipment according to claim 11, wherein the projections are configured for an angle between a direction for feeding the process gas and a central axis of the gas feed nozzle is smaller than 90°

.

16. The film forming equipment according to claim 11, wherein the projections are installed so that the following formula is held when an angle between the directions for feeding the process gas and the central axis of the gas feed nozzle as γ

and an angle between a line connecting an edge of the susceptor and a center of a base of the projections with the central axis of the gas feed nozzle as β

;

β

≦

γ

≦

0.3β

+63 (degrees)

17. The film forming equipment according to claim 11, wherein the rotating mechanism has a rotation control mechanism for controlling a rotational angle.

18. The film forming equipment according to claim 11, wherein the rotating mechanism has a rotational speed control mechanism for controlling a rotational speed.

19. The film forming equipment according to claim 11, further comprising a vertical movement control mechanism for moving the gas feed nozzle up and down.