Programmed material consolidation methods employing machine vision

• US 20070124012A1
• Filed: 01/29/2007
• Published: 05/31/2007
• Est. Priority Date: 06/14/2004
• Status: Abandoned Application

• Current Assignee: Alan Wood, Warren Farnworth
• Original Assignee: Alan Wood, Warren Farnworth
• Inventors: Wood, Alan, Farnworth, Warren
• Application Number:
  US11/699,165
• Publication Number:
  US 20070124012A1
• Time in Patent Office: Days
• US Class Current: 700/118
• CPC Class Codes: B29C 64/112 using individual droplets, e.g. from jetting heads
• CPC Class Codes: B29C 64/129 characterised by the energy source therefor, e.g. by global irradiation combined with a mask
• CPC Class Codes: B33Y 40/00 Auxiliary operations or equipment, e.g. for material handling
• CPC Class Codes: B33Y 40/20 Post-treatment, e.g. curing, coating or polishing
• CPC Class Codes: G03F 7/70416 2.5D lithography
• CPC Class Codes: H01L 24/76 Apparatus for connecting with build-up interconnects
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/0106 Neodymium [Nd]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H10K 71/135 using ink-jet printing

Abstract

Programmed material consolidation methods include the use of electronic viewing or machine vision. A feature or location of a support or substrate is recognized or identified and material dispersed relative to the recognized or identified feature or location. The material may be selectively dispensed and at least partially consolidated either actively or passively. By use of the machine vision system, the precise location on a substrate or support element may be determined and communicated to the dispense element of programmed material consolidation system such that a flowable material may be deposited and consolidated at a desired location to form a structural feature.

Claims

1. A method for forming three-dimensional structures comprising:

providing a support element;

electronically viewing at least a portion of the support element to locate an identified area on or over the support element; and

selectively dispensing unconsolidated material toward the identified area.

2. The method of claim 1, wherein electronically viewing comprises use of a machine vision system.

3. The method of claim 1, wherein electronically viewing comprises locating a feature support element or a substrate thereon.

4. The method of claim 1, further comprising:

at least partially consolidating the unconsolidated material to form at least a portion of a structural feature.

5. The method of claim 4, wherein at least partially consolidating comprises exposing the unconsolidated material to consolidating energy.

6. The method of claim 5, wherein exposing comprises exposing the unconsolidated material to consolidating radiation.

7. The method of claim 5, wherein exposing comprises exposing the unconsolidated material to focused consolidating energy.

8. The method of claim 4, further comprising:

electronically viewing the structural feature.

9. The method of claim 4, further comprising:

locating another identified position on or over the support element.

10. The method of claim 9, further comprising:

selectively dispensing unconsolidated material toward the another identified area.

11. The method of claim 10, further comprising:

at least partially consolidating the unconsolidated material at the another identified area to form at least a portion of another structural feature.

12. The method of claim 1, wherein selectively dispensing comprises selectively dispensing a photopolymer.

13. The method of claim 1, wherein selectively dispensing comprises selectively dispensing unconsolidated material comprising at least one of a metal, an alloy, and a ceramic.

14. The method of claim 1, further comprising:

positioning a substrate on the support element.

15. The method of claim 14, wherein positioning comprises positioning a semiconductor substrate on the support element.

16. The method of claim 15, wherein positioning comprises positioning at least one semiconductor die on the support element.

17. A method for forming a mask element comprising:

providing a substrate;

selectively dispensing unconsolidated sacrificial material onto at least one predetermined location of the substrate;

at least partially consolidating the unconsolidated sacrificial material;

applying unconsolidated material to the substrate and the at least one mask element;

at least partially consolidating the unconsolidated material; and

removing the sacrificial material.

18. The method of claim 17, wherein at least one of selectively dispensing and applying is effected in conjunction with a machine vision system.

19. The method of claim 17, wherein removing the sacrificial material comprises dissolving the sacrificial material.

20. The method of claim 17, wherein providing the substrate comprises providing at least one semiconductor die.

21. The method of claim 20, wherein selectively dispensing comprises selectively dispensing unconsolidated sacrificial material to at least one predetermined location comprising a contact pad and a location for a redistribution line.

22. The method of claim 17, wherein applying comprises applying a photopolymer.

23. The method of claim 17, wherein selectively dispensing comprises selectively dispensing a water soluble material.

24. The method of claim 23, wherein selectively dispensing comprises selectively dispensing a photopolymer.

25. A method of packaging a semiconductor device, comprising:

providing at least one semiconductor die having a back surface and an active surface including at least one array of optically interactive elements thereon;

locating a peripheral region of the at least one array of optically interactive elements; and

selectively dispensing two or more adjacent, mutually adhered regions of consolidatable material to form a support structure that substantially surrounds the at least one array.

26. The method of claim 25, wherein each region of adjacent consolidatable material is at least partially consolidated before depositing another region thereto.

27. The method of claim 25, wherein locating the peripheral region comprises viewing the at least one semiconductor die using a machine vision system.

28. The method of claim 26, further comprising:

viewing each region after dispensing the same.

29. The method of claim 25, further comprising:

securing an infrared filter over the at least one array.

30. The method of claim 25, further comprising:

securing at least one lens over the at least one array.

31. The method of claim 25, wherein selectively dispensing comprises selectively dispensing photopolymer.