AC_LED System in Single Chip with Three Metal Contacts

• US 20070138495A1
• Filed: 12/08/2006
• Published: 06/21/2007
• Est. Priority Date: 12/09/2005
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yeh, Wen-Yung, Lin, Ming-Te, Yen, Hsi-Hsuan, Huang, Sheng-Pan, Kuo, Chia-Chang
• Granted Patent: US 7,948,770 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/42 Antiparallel configurations

Abstract

A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Claims

1. An AC_LED system in a single chip with three metal contacts, comprising:

a plurality of AC_LED units disposed on a substrate;

first, second, and third metal contacts disposed on the substrate;

a first series of AC_LED units having a first end coupled to the first metal contact and a second end coupled to the second metal contact;

a second series of AC_LED units having a first end coupled to the first metal contact and a second end coupled to the third metal contact; and

a third series of AC_LED units having a first end coupled to the second metal contact and a second end coupled to the third metal contact.

2. An AC_LED system in a single chip as claimed in claim 1, wherein each of the metal contacts is a metal pad.

5. An AC_LED system in a single chip as claimed in claim 1, wherein the AC_LED units are disposed with area division between the metal contacts.

3. An AC_LED system in a single chip with four metal contacts, comprising:

a plurality of AC_LED units disposed on a substrate;

first, second, third, and fourth metal contacts disposed on the substrate;

a first series of AC_LED units having a first end coupled to the first metal contact and a second end coupled to the fourth metal contact;

a second series of AC_LED units having a first end coupled to the second metal contact and a second end coupled to the fourth metal contact; and

a third series of AC_LED units having a first end coupled to the third metal terminal and a second end coupled to the fourth metal contact.

4. An AC_LED system in a single chip as claimed in claim 3, wherein each of the metal contacts is a metal pad.

6. An AC_LED system in a single chip with multiple metal contacts, comprising:

a plurality of AC_LED units disposed on a substrate; and

at least three metal contacts;

wherein the AC_LED units are disposed with area division between the metal contacts.

7. An AC_LED system in a single chip comprising twelve DC_LED units on a same substrate, comprising:

seven metal contacts each coupled to neighboring electrodes of neighboring DC_LED units;

a positive electrode of a first DC_LED, a negative electrode of an eighth DC_LED, and a positive electrode of a second DC_LED, being coupled to a second metal contact;

a negative electrode of a second DC_LED, a positive electrode of an ninth DC_LED, and a negative electrode of a third DC_LED, being coupled to a third metal contact;

a positive electrode of a third DC_LED, a negative electrode of a tenth DC_LED, and a positive electrode of a fourth DC_LED, being coupled to a fourth metal contact;

a negative electrode of a fourth DC_LED, a positive electrode of an eleventh DC_LED, and a negative electrode of a fifth DC_LED, being coupled to a fifth metal contact;

a positive electrode of a fifth DC_LED, a negative electrode of a twelfth DC_LED, and a positive electrode of a sixth DC_LED, being coupled to a sixth metal contact;

a negative electrode of a sixth DC_LED, a positive electrode of an eighth DC_LED, and a negative electrode of an eleventh DC_LED, being coupled to a first metal contact; and

a negative electrode of a seventh DC_LED, a positive electrode of an eighth DC_LED, and a negative electrode of a ninth DC_LED, a positive electrode of a tenth DC_LED, and a negative electrode of an eleventh DC_LED, a positive electrode of a twelfth DC_LED, being coupled to a seventh metal contact.

8. An AC_LED system in a single chip as claimed in claim 7, wherein each of the metal contacts is a metal pad.