Flexible electrode array for artificial vision

• US 20070142878A1
• Filed: 10/10/2006
• Published: 06/21/2007
• Est. Priority Date: 11/16/2001
• Status: Active Grant

• Current Assignee: Doheny Eye Institute, Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Humayun, Mark, Krulevitch, Peter, Hamilton, Julie, Weiland, James, Maghribi, Mariam, Polla, Dennis
• Granted Patent: US 7,810,233 B2
• Time in Patent Office: Days
• US Class Current: 607/54
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2203/0733 Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10S 623/90 Stent for heart valve
• CPC Class Codes: Y10S 623/901 Method of manufacturing prosthetic device
• CPC Class Codes: Y10S 623/905 Eye
• CPC Class Codes: Y10S 623/926 Synthetic
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

An image is captured or otherwise converted into a signal in an artificial vision system. The signal is transmitted to the retina utilizing an implant. The implant consists of a polymer substrate made of a compliant material such as poly(dimethylsiloxane) or PDMS. The polymer substrate is conformable to the shape of the retina. Electrodes and conductive leads are embedded in the polymer substrate. The conductive leads and the electrodes transmit the signal representing the image to the cells in the retina. The signal representing the image stimulates cells in the retina.

Claims

1. A method of processing an electrode array for connection to tissue containing cells, comprising the steps of:

implementing initial processing steps on a polymer substrate that has the ability to conform to various shapes of said tissue,

plating or otherwise depositing a conductive material on said polymer substrate to form electrodes on said polymer substrate for contacting said tissue, patterning conducting lines on said polymer substrate, and

implementing final processing steps on said polymer substrate.

2. The method of processing an electrode array of claim 1, wherein said conductive material is biocompatable.

3. The method of processing an electrode array of claim 1, wherein said conductive material is implantable.

4. The method of processing an electrode array of claim 1, wherein said conductive material is gold or platinum.

5. The method of processing an electrode array of claim 1, wherein said polymer is an elastomer.

6. The method of processing an electrode array of claim 1, wherein said polymer is an elastomer that is flexible.

7. The method of processing an electrode array of claim 1, wherein said polymer is an elastomer that is flexible and stretchable.

8. The method of processing an electrode array of claim 1, wherein said elastomer is poly(dimethylsiloxane).

9. A system of fabricating a flexible electrode array, comprising the steps of:

spin-coating a PDMS layer onto a handle wafer that has been pre-coated with a conductive seed layer,

patterning said PDMS to expose said conductive seed layer to form electrodes,

plating said electrodes slightly higher than the thickness of said PDMS until said electrodes form slight mushroom caps which later will prevent said electrodes from popping out of said PDMS when said PDMS is removed from said handle wafer, and

patterning conducing lines on said PDMS.

10. The system of fabricating a flexible electrode array of claim 9, wherein said step of patterning conducing lines on said PDMS is conducted using thin film deposition.

11. The system of fabricating a flexible electrode array of claim 9, wherein said step of patterning conducing lines on said PDMS is conducted using photolithography.

12. The system of fabricating a flexible electrode array of claim 9, wherein said step of patterning conducing lines on said PDMS is conducted using shadow masking.

13. The system of fabricating a flexible electrode array of claim 9, including the step of directly embeding an electrical connector into the device to interface with electronics.

14. The system of fabricating a flexible electrode array of claim 9, including the step of casting a PDMS capping layer to said PDMS.

15. The system of fabricating a flexible electrode array of claim 9, including the step of bonding a PDMS capping layer to said PDMS.

16. The system of fabricating a flexible electrode array of claim 9, wherein said conductive seed layer is biocompatible.

17. The system of fabricating a flexible electrode array of claim 9, wherein said conductive seed layer is gold.

18. The system of fabricating a flexible electrode array of claim 9, wherein said conductive seed layer is platinum.

19. The system of fabricating a flexible electrode array of claim 9, wherein said conductive seed layer is a conductive polymer material.

20. The system of fabricating a flexible electrode array of claim 9, wherein a pre-patterned or formed PDMS layer is bonded to the handle wafer.

21. The system of fabricating a flexible electrode array of claim 9, wherein a pre-patterned or formed PDMS layer is cast in place with a mold.

22. The system of fabricating a flexible electrode array of claim 9, wherein gold electrodes are electroplated onto said conductive seed layer.

23. The system of fabricating a flexible electrode array of claim 9, wherein platinum electrodes are electroplated onto said conductive seed layer.

24. The system of fabricating a flexible electrode array of claim 9, including the step of directly embedding an integrated circuit into the device such that it interfaces with the electrode array.

25. The system of fabricating a flexible electrode array of claim 9, including the step of spinning on a PDMS capping layer to said PDMS.