Methods and apparatuses for regulating the temperature of multi-via heater chips
First Claim
1. A chip for use with a printing device, comprising:
- a first heater array, positioned substantially adjacent a first via;
a second heater array, positioned substantially adjacent a second via;
a region, positioned between the first heater array and the second heater array; and
a temperature sensing element operable to sense the temperature of the region, wherein the temperature sensing element is substantially centrally disposed with respect to the region, wherein the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element, and wherein the received heating regulates the temperature of the region.
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Accused Products
Abstract
Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.
36 Citations
20 Claims
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1. A chip for use with a printing device, comprising:
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a first heater array, positioned substantially adjacent a first via;
a second heater array, positioned substantially adjacent a second via;
a region, positioned between the first heater array and the second heater array; and
a temperature sensing element operable to sense the temperature of the region, wherein the temperature sensing element is substantially centrally disposed with respect to the region, wherein the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element, and wherein the received heating regulates the temperature of the region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of fabricating chips for use with a printing device, comprising:
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providing a first heater array, positioned substantially adjacent a first via;
providing a second heater array, positioned substantially adjacent a second via;
positioning a temperature sensing element in a region between the first heater array and the second heater array, wherein the temperature sensing element is operable to sense the temperature of the region; and
responsive to the temperature of the region sensed by the temperature sensing element, heating the first heater array and the second heater array to regulate the temperature of the region. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification