Film-like article and method for manufacturing the same
First Claim
1. A film-like article comprising:
- a thin film integrated circuit which can store information described on the film-like article; and
an antenna connected to the thin film integrated circuit, wherein the thin film integrated circuit and the antenna are mounted inside the film-like article.
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Accused Products
Abstract
Since the chip formed from a silicon wafer is thick, the chip is protruded from the surface or the chip is so large that it can be seen through the eyes, which affects the design of a business card or the like. Hence, it is an object of the present invention to provide a new integrated circuit which has a structure by which the design is not affected. In view of the above problems, it is a feature of the invention to equip a film-like article with a thin film integrated circuit. It is another feature of the invention that the IDF chip has a semiconductor film of 0.2 mm or less, as an active region. Therefore, the IDF chip can be made thinner as compared with a chip formed from a silicon wafer. In addition, such an integrated circuit can have light transmitting characteristic unlike a chip formed from a silicon wafer.
31 Citations
48 Claims
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1. A film-like article comprising:
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a thin film integrated circuit which can store information described on the film-like article; and
an antenna connected to the thin film integrated circuit, wherein the thin film integrated circuit and the antenna are mounted inside the film-like article. - View Dependent Claims (3, 8, 13, 18, 23, 28, 33, 34, 39)
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2. A film-like article comprising:
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a thin film integrated circuit which can store information described on the film-like article; and
an antenna connected to the thin film integrated circuit, wherein the thin film integrated circuit is mounted inside the film-like article, and the antenna is mounted on a surface of the film-like article. - View Dependent Claims (4, 9, 14, 19, 24, 29, 35, 40)
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5. A film-like article comprising:
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a thin film integrated circuit which can store information described on the film-like article; and
an antenna connected to the thin film integrated circuit, wherein the thin film integrated circuit and the antenna are mounted on a surface of the film-like article. - View Dependent Claims (10, 15, 20, 25, 30, 36, 41)
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6. A film-like article comprising:
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a thin film integrated circuit which can store information described on the film-like article; and
an antenna connected to the thin film integrated circuit, wherein the thin film integrated circuit is mounted on a surface of the film-like article, and the antenna is mounted inside the film-like article. - View Dependent Claims (11, 16, 21, 26, 31, 37, 42)
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7. A film-like article comprising a thin film integrated circuit which can store information described on the film-like article,
wherein the film-like article is provided with a depression, and the thin film integrated circuit includes an antenna.
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44. A method for manufacturing a film-like article, comprising the steps of:
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forming a plurality of thin film integrated circuits over a first substrate;
transferring the plurality of thin film integrated circuits to a second substrate;
cutting the second substrate to cut out each of the plurality of thin film integrated circuits;
connecting an antenna to a connection terminal of the thin film integrated circuits; and
enfolding the thin film integrated circuits and the antenna in a base member of the film-like article.
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45. A method for manufacturing a film-like article, comprising the steps of:
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forming a plurality of thin film integrated circuits over a first substrate;
transferring the plurality of thin film integrated circuits to a second substrate;
cutting the second substrate to cut out each of the plurality of thin film integrated circuits;
connecting an antenna to a connection terminal of the thin film integrated circuits; and
mounting the thin film integrated circuits and the antenna on a surface of a base member of the film-like article.
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46. A method for manufacturing a film-like article, comprising the steps of:
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forming a plurality of thin film integrated circuits over a first substrate;
transferring the plurality of thin film integrated circuits to a second substrate;
cutting the second substrate to cut out each of the plurality of thin film integrated circuits;
connecting an antenna to a connection terminal of the thin film integrated circuits; and
mounting the thin film integrated circuits and the antenna in a depression on a surface of a base member of the film-like article.
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47. A method for manufacturing a film-like article, comprising the steps of:
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forming a plurality of thin film integrated circuits over a first substrate;
transferring the plurality of thin film integrated circuits to a second substrate;
cutting the second substrate to cut out each of the plurality of thin film integrated circuits; and
enfolding the thin film integrated circuit in a base member of the film-like article, forming an antenna on a surface of the base member of the film-like article so that the thin film integrated circuits and the antenna are connected through an opening formed on the base member of the film-like article.
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48. A method for manufacturing a film-like article, comprising the step of forming an antenna on a surface of a base member of the film-like article so that a plurality of thin film integrated circuits and the antenna are connected through an opening formed on the base member of the film-like article,
wherein a plurality of thin film integrated circuits are formed over a first substrate, the plurality of thin film integrated circuits are transferred to a second substrate, and the second substrate is cut so as to cut out the plurality of thin film integrated circuits.
Specification