Electronic device and method of forming an electronic device

• US 20070171078A1
• Filed: 12/28/2006
• Published: 07/26/2007
• Est. Priority Date: 06/29/2005
• Status: Active Grant

• Current Assignee: LYNC Circuits Limited
• Original Assignee: Martin Cotton
• Inventors: Cotton, Martin
• Granted Patent: US 8,072,326 B2
• Time in Patent Office: Days
• US Class Current: 340/572.800
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

Abstract

An electronic device comprising an RFID component which can act in an active mode and a passive mode. Preferably the electronic device is a PCB and the RFID component is at least partially located in the PCB. More preferably, the RFID component is located within the PCB. An electronic device comprising an embedded active component is disclosed. A method of exchanging information within an electronic device is disclosed comprising the steps in providing an electronic device which contains an RFID component which connect in a active and a passive mode, and a remote RFID device, and exchanging information between the RFID component and the remote RFID device.

Claims

1. An electronic device comprising an RFID component which can act in an active mode and a passive mode.

2. A device according to claim 1 wherein the RFID component is on a PCB.

3. A device according to claim 2 wherein the RFID component is at least partially located in the PCB.

4. A device according to claim 2 wherein the RFID component is at least partially integrated into the PCB.

5. A device according to claim 2 wherein the RFID component is completely integrated into the PCB.

6. A device according to claim 2 wherein the RFID component is at least partially integrated into the surface of the PCB.

7. A device according to claim 2 wherein the RFID component is located within the PCB.

8. A device according to claim 2 wherein the PCB is a multilayer PCB.

9. A device according to claim 8 wherein the RFID component is electronically connected to a layer of the PCB.

10. A device according to claim 9 wherein the layer is located within the PCB.

11. A device according to claim 2 wherein the RFID component comprises an antenna.

12. A device according to claim 11, wherein the antenna comprises metal.

13. A device according to claim 11, wherein the antenna comprises copper, platinum, silver, gold, tin and/or aluminium.

14. A device according to claim 11 wherein the antenna comprises conductive polymer, conductive ink and/or conductive plastics.

15. A device according to claim 2 wherein the active mode of the RFID component is powered by electrical energy supplied through the PCB.

16. A device according to claim 2 wherein the RFID component can transmit and receive information.

17. A device according to claim 2 which is made by mass-lamination techniques.

18. A method of making an electronic device comprising the step of providing an RFID component which can act in an active mode and a passive mode.

19. A method according to claim 18 wherein the method comprises mass-lamination techniques.

20. A method according to claim 18, further comprising the steps of providing a Remote RFID Device and exchanging information between the RFID component and the Remote RFID Device.

21. A method according to claim 20 wherein the information exchange occurs during the manufacture of the electronic device or its components.

22. A method according to claim 20, wherein the information comprises identification information.

23. A method according to claim 20, wherein the information comprises information other than identification information.

24. An electronic device comprising an embedded active component.

25. A device according to claim 24, wherein the device comprises a laminate structure.

26. A device according to claim 24, wherein the device is a layer grouping.

27. A device according to claim 24, wherein the device forms part of a larger device.

28. A device according- to any of claim 24, wherein the component is located within a layer within a multi-layer circuit board.

29. A device according to any of claim 24, wherein the component is an RFID device.

30. A device according to claim 29, wherein the component can act in an active and in a passive mode.