Wafer encapsulated microelectromechanical structure and method of manufacturing same

• US 20070172976A1
• Filed: 11/06/2006
• Published: 07/26/2007
• Est. Priority Date: 01/20/2006
• Status: Active Grant

• Current Assignee: SiTime Corporation (Megachips Corporation)
• Original Assignee: SiTime Corporation (Megachips Corporation)
• Inventors: Partridge, Aaron, Lutz, Markus, Gupta, Pavan
• Granted Patent: US 8,871,551 B2
• Time in Patent Office: Days
• US Class Current: 438/53
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0035 for maintaining a controlled atmosphere inside of the chamber containing the MEMS
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 1/00277 for maintaining a controlled atmosphere inside of the cavity containing the MEMS
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2201/0171 Doping materials
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B81C 2203/037 Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 30/306 Cantilevers

Abstract

There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

Claims