Electronic device cleaning equipment and electronic device cleaning method

• US 20070181163A1
• Filed: 10/20/2006
• Published: 08/09/2007
• Est. Priority Date: 02/09/2006
• Status: Abandoned Application

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Wada, Yukihisa, Saito, Kazuhide, Watanabe, Masayuki
• Application Number:
  US11/583,847
• Publication Number:
  US 20070181163A1
• Time in Patent Office: Days
• US Class Current: 134/26
• CPC Class Codes: H01L 21/0206 during, before or after processing of insulating layers
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

Electronic device cleaning equipment includes a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed, a vapor supply nozzle for supplying vapor to the obverse face of the substrate, and chemical solution supply means for supplying a chemical solution to the obverse face of the substrate. Accordingly, static electricity present on the obverse face of the substrate is diselectrified.

Claims

1. Electronic device cleaning equipment, comprising:

a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;

a vapor supply nozzle for supplying vapor to the obverse face of the substrate; and

chemical solution supply means for supplying a chemical solution to the obverse face of the substrate.

2. The electronic device cleaning equipment of claim 1,

wherein the chemical solution supply means is a chemical solution nozzle for discharging the chemical solution to the obverse face of the substrate.

3. The electronic device cleaning equipment of claim 1,

wherein the vapor supply nozzle is in the form capable of being arranged along the periphery of the cleaning stage above the cleaning stage.

4. The electronic device cleaning equipment of claim 1,

wherein the vapor includes at least one of water, soda water, and alcohol.

5. Electronic device cleaning equipment, comprising:

a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;

a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate; and

a vapor supply nozzle for supplying vapor to the chemical solution nozzle.

6. The electronic device cleaning equipment of claim 5,

wherein the vapor supply nozzle is in the form capable of surrounding a discharge port of the chemical solution nozzle.

7. The electronic device cleaning equipment of claim 5,

wherein the vapor includes at least one of water, soda water, and alcohol.

8. Electronic device cleaning equipment, comprising:

a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;

a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate; and

a conductive cup which retains a solution and is electrically grounded, a discharge port of the chemical solution nozzle being to be dipped into the solution.

9. The electronic device cleaning equipment of claim 8,

wherein the solution includes at least one of a chemical solution, soda water, and water.

10. Electronic device cleaning equipment, comprising:

a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;

a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate; and

a conductive member for diselectrifying static electricity present at the chemical solution nozzle, the conductive member being grounded electrically.

11. The electronic device cleaning equipment of claim 10,

wherein the conductive member is in the form capable of surrounding a discharge port of the chemical solution nozzle.

12. An electronic device cleaning method, comprising the steps of:

(a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;

(b) supplying vapor to the obverse face of the substrate; and

(c) supplying a chemical solution to the obverse face of the substrate after the step (b).

13. The electronic device cleaning method of claim 12,

wherein in the step (c), the chemical solution is discharged to the obverse face of substrate from a chemical solution nozzle.

14. The electronic device cleaning method of claim 12,

wherein in the step (b), the vapor is sprayed to the obverse face of the substrate by a vapor supply nozzle arranged along the periphery of the cleaning stage above the cleaning stage.

15. The electronic device cleaning method of claim 12,

wherein the vapor includes at least one of water, soda water, and alcohol.

16. An electronic device cleaning method, comprising the steps of:

(a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;

(b) supplying vapor to a chemical solution nozzle; and

(c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).

17. The electronic device cleaning method of claim 16,

wherein in the step (b), the vapor is sprayed to the chemical solution nozzle by a vapor supply nozzle arranged so as to surround a discharge port of the chemical solution nozzle.

18. The electronic device cleaning method of claim 16,

wherein the vapor includes at least one of water, soda water, and alcohol.

19. An electronic device cleaning method, comprising the steps of:

(a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;

(b) dipping a discharge port of a chemical solution nozzle into an electrically grounded solution; and

(c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).

20. The electronic device cleaning method of claim 19,

wherein the solution includes at least one of a chemical solution, soda water, and water.

21. An electronic device cleaning method, comprising the steps of:

(a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;

(b) diselectrifying static electricity present at a chemical solution nozzle with the use of an electrically grounded conductive member; and

(c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).

22. The electronic device cleaning method of claim 21,

wherein in the step (b), the static electricity present at the chemical solution nozzle is diselectrified with the use of the conductive member arranged so as to surround a discharge port of the chemical solution nozzle.