Interconnect structure for MEMS device

• US 20070189654A1
• Filed: 01/13/2006
• Published: 08/16/2007
• Est. Priority Date: 01/13/2006
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Lasiter, Jon
• Granted Patent: US 7,916,980 B2
• Time in Patent Office: Days
• US Class Current: 385/1
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

An iterferometric modulator array is formed with connectors and/or an encapsulation layer with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.

Claims

1. An electronic device, comprising:

a substrate;

an array of interferometric light modulators formed on said substrate; and

a plurality of interconnects formed adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit.

2. The device of claim 1, comprising at least one connector configured to connect said plurality of interconnects to said circuit.

3. The device of claim 1, wherein said plurality of interferometric modulators comprises 90 percent of the interferometric modulators in said array.

4. The device of claim 1, wherein said plurality of interconnects are formed on a layer adjacent to said plurality of interferometric light modulators.

5. The device of claim 1, wherein the circuit comprises a display driver circuit.

6. The device of claim 2, wherein said at least one connector comprises connector bumps.

7. The device of claim 6, wherein the plurality of connector bumps are arranged with a pitch between about 40 microns and about 60 microns.

8. The device of claim 1, wherein said interconnects comprise at least one of active circuitry or passive circuitry.

9. The device of claim 8, wherein said passive circuitry comprises at least one of a capacitor, an inductor, or a resistor.

10. The device of claim 8, wherein said active circuitry comprises at least one of a diode, a transistor, a zener diode, or circuit protection devices.

11. The device of claim 1, further comprising an encapsulation layer formed adjacent said plurality of interferometric modulators.

12. The device of claim 1, wherein the encapsulation layer comprises one or more electrical connections that connect said plurality of interconnects to said plurality of interferometric modulators.

13. The device of claim 1, wherein the device is a cell phone.

14. The device of claim 1, further comprising:

a processor that is in electrical communication with said interferometric modulator, the processor being configured to process image data; and

a memory device in electrical communication with the processor.

15. The device of claim 14, further comprising a driver circuit configured to send at least one signal to the interferometric modulator.

16. The device of claim 15, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

17. The apparatus of claim 14, further comprising an image source module configured to send the image data to the processor.

18. The device of claim 17, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The device of claim 14, further comprising an input device configured to receive input data and to communicate the input data to the processor.

20. A method of manufacturing an electronic device, the method comprising:

providing a substrate comprising an array of interferometric light modulators formed on said substrate; and

forming a plurality of interconnects adjacent a plurality of said interferometric modulators, wherein each interconnect is configured to connect a single light modulator to a circuit.

21. The method of claim 20, further comprising forming at least one connector configured to connect said plurality of interconnects to said circuit.

22. The method of claim 20, wherein said plurality of interconnects are formed on a layer adjacent to said plurality of interferometric light modulators.

23. The method of claim 20, wherein the circuit comprises a display driver circuit.

24. The method of claim 21, wherein said at least one connector comprises connector bumps.

25. An electronic device made by the method of claim 20.

26. An electronic device, comprising:

a substrate;

an interferometric modulator disposed on said substrate, wherein said interferometric modulator comprises a cavity defined by an upper layer and a lower layer; and

an encapsulation layer formed adjacent to the interferometric modulator, said encapsulation layer comprising a sealed orifice, wherein said encapsulation layer hermetically seals said cavity from the ambient environment.

27. The device of claim 26, wherein the encapsulation layer comprises an electrical connection that connects the interferometric modulator to an electronic circuit.

28. The device of claim 26, wherein the sealed orifice comprises a via.

29. The device of claim 26, wherein the cavity comprises a vacuum or inert atmosphere.

30. The device of claim 26, further comprising one or more interconnect layers formed adjacent to the encapsulation layer and configured to connect said interferometric modulator to said electronic circuit.

31. The device of claim 30, wherein said interconnect layers comprise one or more circuit elements.

32. The device of claim 31, further comprising one or more connectors formed adjacent the encapsulation layer and configured to electrically connect said interferometric modulators to said electronic circuit.

33. A method of manufacturing a light modulator device, the method comprising:

forming an interferometric modulator, wherein said modulator comprises first and second layers defining a cavity and configured to interferometrically modulate light;

forming an encapsulation layer adjacent to the cavity, the layer comprising one or more orifices;

inducing a vacuum or inert atmosphere in the cavity; and

sealing the one or more orifices.

34. The method of claim 33, further comprising:

forming a sacrificial layer adjacent to the first layer; and

removing the sacrificial layer through the one or more orifices in the encapsulation layer.

35. The method of claim 33, further comprising:

forming a sacrificial layer adjacent to the first layer; and

removing the sacrificial layer, wherein the encapsulating layer remains spaced apart from the first layer.

36. The method of claim 33, wherein sealing the one or more orifices comprises sealing the one or more orifices with a conductive material so as to provide an electrical connection to said first layer and wherein said sealing maintains the vacuum or inert atmosphere in the cavity.

37. The method of claim 36, further comprising forming one or more interconnect layers adjacent to the encapsulating layer, wherein at least one of the interconnect layers is connected to the conductive material.

38. The method of claim 36, further comprising forming one or more circuit elements adjacent to the encapsulating layer, wherein at least one of the circuit elements is connected to the conductive material.

39. The method of claim 33, further comprising forming one or more connectors adjacent to the encapsulating layer, wherein the connectors are configured to connect to a circuit.

40. The method of claim 39, further comprising forming one or more circuit elements adjacent to the first layer, wherein at least one of the circuit elements is connected to the conductive material and/or to one or more of the connectors.

41. An electronic device manufactured by the process of claim 33.

42. An electronic device, comprising:

means for transmitting light;

an array of means for modulating light formed on said transmitting means; and

a plurality of means for interconnecting formed adjacent a plurality of said light modulating means, wherein each of said interconnecting means is configured to connect a single light modulating means to a circuit.

43. The device of claim 42, further comprising connecting means for connecting said plurality of interconnecting means to said circuit.

44. The device of claim 42, wherein said transmitting means comprises a substrate.

45. The device of claim 42, wherein said light modulating means comprises an interferometric light modulator.

46. The device of claim 42, wherein said connecting means comprises a connection bump.