Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method

  • US 20070228567A1
  • Filed: 03/28/2007
  • Published: 10/04/2007
  • Est. Priority Date: 09/28/2004
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor chip comprising a metal coating structure on the active upper side of the semiconductor chip, the metal coating structure having copper-containing interconnects and contact terminal areas and precious-metal-containing bonding areas on the upper side of the semiconductor chip, and the metal coating structure having a number of metal layers arranged one on top of the other, a copper-containing lower metal layer forming the interconnects and the contact terminal areas, a central metal layer, comprising nickel and/or nickel phosphide, covering the lower metal layer, and upper metal layers, comprising palladium and/or precious metals, covering at least the bonding area regions, and the central metal layer, comprising nickel and/or nickel phosphide, having a rough interface with respect to a plastic package molding compound surrounding the metal coating structure and/or with respect to the upper metal layers.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×